1.
MODELING OF Ag_3Sn COARSENING AND ITS EFFECT ON CREEP IN Sn-Ag-Cu SOLDER
Ag_3Sn粗化模型及其对Sn-Ag-Cu焊料蠕变的影响
2.
Research on Properties of Sn-Ag-Cu Solder Alloy Doped with Sb;
掺杂Sb的Sn-Ag-Cu系焊料合金性能的研究
3.
Microstructure and Solderability of Sn-Ag-Cu Lead-free Solder Powder and Alloy
Sn-Ag-Cu无铅钎料粉末与合金的组织及钎焊性能对比
4.
Wettability of Sn-Zn,Sn-Ag-Cu and Sn-Bi-Cu Lead-free Solder Alloys with Copper Substrate
Sn-Zn,Sn-Ag-Cu和Sn-Bi-Cu无铅焊锡合金与铜的润湿性
5.
Ag-Cu-Sn Compound Electronic Support Material
Ag-Cu-Sn复合电子支架功能材料
6.
Regression analysis for Sn-Ag-Bi-Cu lead-free solder conductive properties
Sn-Ag-Bi-Cu无铅钎料导电性能回归分析
7.
Study on Production of Free-Lead Solder Alloy and Solder Alloy Fine Powder of Sn-Ag-Cu System;
Sn-Ag-Cu系无铅焊锡合金及其微粉制备技术研究
8.
The Improvement and Performance Analysis of Sn-Ag-Cu Lead-Free Solder Paste;
Sn-Ag-Cu系无铅焊锡膏组成优化与性能研究
9.
Study on Indentation Creep Behavior of the Sn-Ag-Bi Lead-free Solder;
Sn-Ag-Bi无铅焊料压入蠕变性能的研究
10.
The Research of Sn-Zn System without Ag Lead-free Solder
新型Sn-Cu系无银无铅焊料的研究
11.
A Study on the Active Brazing of AlN to W-Cu Alloy with Ag-Ti_4 Active Filler Alloy
Ag-Ti_4活性钎料钎焊AlN与W-Cu合金研究
12.
Brazing of SiC Ceramics Using Ag-Cu-In-Ti Filler Metal
采用Ag-Cu-In-Ti焊料连接碳化硅陶瓷
13.
Separation and Controlling of Intermetallic Compounds in Lead-free Sn-Ag Solders;
Sn-Ag系无铅焊料中金属间化合物的形成与控制
14.
Effect of Ag and Ni on melting temperature and spreadability of Sn-SbCu solder alloy
Ag和Ni元素对Sn-Sb-Cu无铅钎料熔化温度和铺展性能的影响
15.
Research on the Properties and the Interfacial Reactions of Sn-Zn-Cu(Ni) Lead-free Solders;
Sn-Zn-Cu（Ni）无铅钎料及其钎焊接头界面反应研究
16.
Effect of Cu and Ni on microstructure and properties of Sn-Zn-Al lead-free solders
Cu,Ni对Sn-Zn-Al无铅焊料组织和性能的影响
17.
Brazing of C_f/SiC composite to Ti alloy using Ag-Cu-Ti-TiC composite filler materials
C_f/SiC复合材料与Ti合金的Ag-Cu-Ti-TiC复合钎焊
18.
Separation of Intermetallic Compounds in the Microstructure of Eutectic Sn-Ag-Zn Solder Solidified at Different Cooling Rates;
宽冷却速度下共晶Sn-Ag-Zn焊料组织中金属间化合物的析出