1.
300 mm Si Wafer Manufacture and New Development
300mm Si片加工及最新发展
2.
Analysis of Forming Reasons for Corner Cracks on Continuously Cast Heavy Slabs of 300 mm Thickness at Ansteel
鞍钢300mm厚板坯连铸角裂产生原因分析
3.
Study on Removal Mechanism of Ductile-Mode Grinding in 300mm Silicon Wafer Surface Grinding Process
300mm硅片表面延性磨削机理研究
4.
Most of the casein in milk is in the form of casein micelles, aggregates of several thousand casein molecules with a diameter of 10～300 nm.
数千万个酪蛋白分子的聚合体直径为10-300mm
5.
Investigation of Thermally Induced Microdefects in 300 mm Heavily Boron Doped Si Substrates Used for Epitaxy
外延用300mm重掺B Si衬底中热致微缺陷研究
6.
Pseudo-static Experimental Research on RC Fully 300mm-Staggered Joint and Nonlinear Finite Element Analysis;
钢筋混凝土框架完全错开300mm节点拟静力试验与非线性有限元分析
7.
Effects of Nitrogen on Oxidation-Induced Stacking Faults in 300 mm CZ Silicon
300mm直拉单晶硅中的氮元素对氧化诱生层错的影响
8.
300mm Lithography and Bonding Technologies for TSV Applications in Image Sensor and Memory Products
在图像传感器和存储产品中应用硅通孔工艺的300mm光刻与键合技术(英文)