1.
Analysis of EM Scattering by Electrically Small 3-D Multi-conducting Bodies
![点击朗读](/dictall/images/read.gif)
三维电小尺寸目标群的电磁散射分析(英文)
2.
Calculation on Radar Cross Section of Electrically Large Targets Modeled with NURBS;
![点击朗读](/dictall/images/read.gif)
基于NURBS电大尺寸目标RCS计算
3.
Calculation and Analysis of Electronically Large Size Satellite Target's RCS using PO Method
电大尺寸卫星目标RCS的PO法计算与分析
4.
Hybridization of MoM-SBR/PO for computing electromagnetic scattering of electrical large-size complex conducting bodies
一种计算电大尺寸复杂导体目标电磁散射的MoM-SBR/PO混合法
5.
Double-Objective Optimal Design for Minimum Size and Maximum Efficiency of Disk Cam Mechanism
盘形凸轮机构按尺寸最小和效率最高的双目标优化设计
6.
The minimum mesh size of the trawl cod-end in South China Sea
![点击朗读](/dictall/images/read.gif)
GB11780-1989南海区拖网网囊最小网目尺寸
7.
The row or column value is too large or small for this sheet of labels.
![点击朗读](/dictall/images/read.gif)
此标签行或栏的尺寸过大或过小。
8.
Undersize crankshaft main bearing journals.
![点击朗读](/dictall/images/read.gif)
尺寸小于标准的凸轮轴主轴承轴颈。
9.
Standard linear dimensions
![点击朗读](/dictall/images/read.gif)
GB/T2822-1981标准尺寸
10.
Means to Reduce the Electrical Terminal Box Size of Underground Explosion-proof Motors
![点击朗读](/dictall/images/read.gif)
减小井下防爆电机接线盒尺寸的措施
11.
Temperature Characteristics Model of Threshold Voltage in Small Size VDMOS
![点击朗读](/dictall/images/read.gif)
小尺寸VDMOS阈值电压温度特性模型
12.
Oh, it's a junior size.
![点击朗读](/dictall/images/read.gif)
噢,这个小号尺寸。
13.
Research On Rigorous Modeling and High Efficient Algorithms for 3D EM Scattering by Large Body with Open Cavities;
电大尺寸含腔体复杂目标矢量电磁散射一体化精确建模与高效算法研究
14.
Structural Optimization of A Bolt-Flange Structure Based on Response Surface Design Method
基于多目标优化的螺栓-法兰连接结构尺寸设计
15.
Mean-Shift tracking algorithm with adaptive bandwidth of target
![点击朗读](/dictall/images/read.gif)
目标窗口尺寸自适应变化的Mean-Shift跟踪算法
16.
Structural dimension design of wedged-ring linking based on multi-objective optimization
![点击朗读](/dictall/images/read.gif)
基于多目标优化的楔环连接结构尺寸设计
17.
The reduction in size of components and circuits for increasing package density and reducing power dissipation and signal propagation delays.
减少元件和电路的几何尺寸,以达到增加电路的封装密度、减少功耗和减小信号传播延迟的目的。
18.
The problem of scheduling jobs with non-identical sizes on parallel batching machines is considered; the objective is to minimize the maximum completion time (makespan).
考虑并行批加工机上不同尺寸工件的调度问题;目标是极小化最大完工时间。