1.
bumped tape automated bonding
链式隆起焊盘带自动焊接
2.
Effect of Solder Pad Size on Solder Joint Reliability upon Flip Chip PBGA Packages
焊盘尺寸对FC-PBGA焊点可靠性的影响
3.
To achieve the required bump heights, the solder paste is over-printed onto the wafer bond pads.
为了获得要求的凸起高度，锡膏在晶片焊盘过焊。
4.
When human has contact to Touch pad, electric charge in the human body will be accumulated through the Touch pad.
当人体接触感应焊盘时，在人体里的电荷将被通过感应焊盘积累。
5.
Influence of Phosphorus on Reliability of Interface between Au/Ni/Cu Pad and SnAgCu Solder Joint
P对Au/Ni/Cu焊盘与SnAgCu焊点焊接界面可靠性的影响
6.
A Method of Automatic Recognition of Bonding Pad and its Application;
一种芯片焊盘自动识别方法及其应用
7.
Discussion for Black Pad and Failure Analysis for Related Example
黑焊盘有关问题探讨及失效案例分析
8.
Randomized Hough Transform Recognising PCB Round PAD
随机Hough变换识别PCB圆形焊盘
9.
Sometimes aperture openings need to be offset so they are not centered directly over pads.
有时孔口应偏移，因此，他们不直接正对焊盘中央。
10.
Research of Reliability of SMT Soldering Pad Design
表面组装元器件焊盘设计的可靠性研究
11.
The Study on Reactive Wettability of SnAgCu Solder Alloy on Au/NiFe/Cu PAD
SnAgCu钎料合金在Au/NiFe/Cu焊盘上的反应润湿研究
12.
Solder paste is applying for the connection between the mount components foot and PCB pads in the SMT assembly.
在表面贴装装配的回流焊接中，锡膏用于表面贴装元件的引脚或端子与焊盘之间的连接。
13.
When the pad area is greater than66 percent of the aperture wall surface area, the probability of achieving efficient paste transfer is increased.
当焊盘面积大于孔壁表面积的66%提高锡膏有效转移的可能性。
14.
Those with money had plates made of pewter.
有钱人使的是用焊锡做的盘子。
15.
Stainless steel wire rods for welding
GB/T4241-1984焊接用不锈钢盘条
16.
Automatic Weld Parameter Set-Up including Pnelmate screen display.
焊接参数自动设定,包括盘面屏幕显示
17.
Study on the Disc Welding Technologic Test of Magneto Rotor
永磁电机转子圆盘焊接工艺试验研究
18.
Dynamic Simulation of the Linear Friction Welding Process of Blisk;
整体叶盘线性摩擦焊接过程动态仿真