1.
A plurality of ceramic substrates are used to manufacture and integrate a highly integrated multi-layer circuit module.
复数个陶瓷基板被用来制造和整合一高整合多层电路模组。
2.
multilayer and high density fine-pitch printed circuit board
多层和高密度细线距的印刷电路板；多层和高密度细线距的线路板
3.
Semi-passive Multiple Patches Piezoelectric Sound Absorption Technology and Its Electrical Equivalent Model
半被动多层压电吸声技术及其电路模型
4.
Technology of Multilayers Structure in Thin Film Microwave and Millimeter Wave Integrated Circuits
多层结构微波毫米波薄膜电路制作工艺研究
5.
Low Cost Printed Flexible Multilayer Substrates
多层柔性衬底电路板的低成本丝网印刷
6.
Electromagnetic Modeling and Design Methodologies for Passive Components in Multilayer Ceramic Integrated Circuits;
多层陶瓷集成电路中无源元件的电磁建模与设计方法
7.
The Influence of the Multi-Layer Cabling Structure in Integrated Circuit on the Signal Delay;
大规模集成电路多层布线结构对信号延时的影响
8.
Job Shop Printed Circuit Board Assembly Optimization Based on Model Constrainted by Polychromatic Sets
基于多色集合约束模型的车间层印刷电路板组装优化
9.
Application ol Intelligent Multilayer Routing Switch to Substation Automation System
智能路由多层交换机在变电站自动化系统中的应用
10.
interlayer contact
层间接触-印制电路板的
11.
interlayer continuity
层间连接-印制电路板的
12.
Data Link Layer
ph.1. 【电脑】数据链路层
13.
multiplexer switch circuit
多路转换器开关电路
14.
Layer-by-Layer Self-Assembly of Conducting Multilayer Films and Research on Their Properties
导电多层膜的层层自组装及性能研究
15.
Wireline Formation Testing Interpretation Method in Multi-Layer Formation Vertically
纵向多层储层电缆地层测试解释方法
16.
Thin polyimide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards
GB/T16317-1996多层印制电路用限定燃烧性的薄覆铜箔聚酰亚胺玻璃布层压板
17.
| wandering block sequence
电弧飘移多层焊次序
18.
automatic multifrequency ionospheric recorder
自动多频电离层记录器