1.
Thermal Stress Analysis of Stacking Chip Scale Package under Power Load;
功率载荷下叠层芯片尺寸封装热应力分析
2.
A Study on Thermal Stress and Invalidation for Chip Scale Package;
芯片尺寸封装（CSP）的热应力及热失效分析研究
3.
Integrated power electronics module based on chip scale packaged power devices
基于芯片尺寸封装功率器件的集成电力电子模块(英文)
4.
Dimensions of the cores for motion-picture film rolls
GB/T6848-1986电影胶片片卷片芯尺寸
5.
Reliability of SOP Component Solder Joint
小尺寸封装(SOP)器件焊点可靠性研究
6.
ASIC Design of Driver & Controller for Small Dot-Matrix Gray Scale STN LCD;
中小尺寸灰度点阵液晶驱动控制芯片的设计
7.
An Overview of Non destructive Inspection in Flip Chip Packaging
倒装焊芯片封装中的非接触检测技术
8.
Flip Chip will be a New Method of Packaging Technology
倒装芯片将成为封装技术的最新手段
9.
Bumping Technology for MEMS Flip Chip Packaging;
MEMS封装中的倒装芯片凸点技术
10.
Area Array Package--BGA/CSP & flip chip
BGA/CSP和倒装焊芯片面积阵列封装技术
11.
Research on welding fault during LED chips packaging
LED芯片封装工艺中焊接缺陷研究
12.
Thermal Stress Analysis and Optimization of SCSP Chip Package
叠层CSP芯片封装热应力分析与优化
13.
The Main Factors Causing Die Crack in IC Assembly Process
IC封装中引起芯片裂纹的主要因素
14.
Multi-chip Array Combination White Light LED Seal Research
多芯片阵列组合白光LED封装研究
15.
Comprehensive Comparison Between FC and CSP and Their Development Anticipation
倒装片封装与芯片规模封装的综合比较及其发展前景
16.
Research on the thermal stress and warpage of WLCSP device
晶圆尺寸级封装器件的热应力及翘曲变形
17.
SIZE EFFECT OF MECHANICAL BEHAVIOR OF MINIATURE SOLDER JOINT INTERCONNECTIONS IN ELECTRONIC PACKAGING
电子封装微互连焊点力学行为的尺寸效应
18.
Classification and mounting dimensions for domed metal bursting disc devices
GB/T12353-1990拱型金属爆破片装置分类与安装尺寸