1.
Abstract: A high density packaging with superior thermal con duction and electrical performance, in which metal served as substrate or package, is introduced in this paper.
文摘:以金属为外壳的封装是一种新的高密度封装技术，具有优异的导热性能及电性能。
2.
The letter was contained in a bottle fast as a Kentish oyster.
那封信装在一只高度密封的瓶子里。
3.
Investigation of Improving HD-PCB Substrate Packaging Quality
改善PCB高密度基板封装质量的研究
4.
High-density IC Packaging Based on Flexible Printed Circuit
基于挠性基板的高密度IC封装技术
5.
3D Stacking Packaging in SMT for High Density Packaging
满足高密度组装的SMT三维封装堆叠技术
6.
The Investigation of 2-DOF High-speed and High-precision Positioning System for IC Packaging;
面向IC封装的两自由度高速精密定位系统研究
7.
high desity assembly
高密度装配高密度组件
8.
In relation to an integrated circuit;a term that indicates small element size and high packing density.
集成电路技术中的一种修饰术语，表示元件体积小而且封装密度高。
9.
Numerical Simulation Study and Application of Interface Delamination in High Density Electirc Packaging;
高密度芯片封装中界面分层的数值模拟研究及其应用
10.
Optimised Integration of PrimePACK~(TM) into Modular IGBT Stacks with Increased Power Density
PrimePACK~(TM)封装优化集成模块内的IGBT叠层可提高功率密度
11.
Research on Soft Measurement of Internal Temperature and Relative Humidity in Sealed Packages;
密封包装箱内温湿度软测量系统研究
12.
Shorts between metal runners are important only in those regions of the chip with a high density of closely packed metal runners.
金属布线间的短接，仅在那些具有高密度密集封装型金属布线的芯片中才极为重要。
13.
High activity cobalt-60 sealed radioactive sources
GB7465-1994高活度钴-60密封放射源
14.
Study on High-Strength RTV Silicone Sealant
高强度有机硅密封剂的耐热性能研究
15.
EFFECT OF POTTING ON THE PACKAGING OF HIGH-G MEMS ACCELEROMETER
灌封对高量程微机械加速度计封装的影响
16.
Improve the product exhibit and sell through packaging, and is damp-proof by sealing.
通过包装提高物品的展销性，并能密封、潮、潮染。
17.
The Thermal Stress Analysis on High Pressure SelfTight Seal Device with Shear Bolts
抗剪螺栓高压自紧密封装置的温差应力分析
18.
Design and Investigation of High-Speed and High-precision Positioning System for IC Packaging;
面向IC封装的高速精密定位系统设计与研究