1.
Technology for End-coating Chip Resistors and the Structure and Principle of the End-coating Machine
片式电阻器封端工艺及封端机的结构原理
2.
Numerical Analyses of Gas Lubricated Laser Surface Textured Mechanical Seals
激光加工多孔端面气体密封数值分析
3.
High Speed On-off Valve PWM Control Cylinder System with Closed Terminal
PWM阀控单端封闭气缸系统的工作
4.
Seal Structure and Technique of Broad Band High Power Rectangular Ceramic Hermetic Windows
宽带高功率矩形陶瓷密封窗封接结构及工艺
5.
Research on Thermal Spraying for Flow Oil-seal Ring and Its Application
浮动油封密封环热喷涂工艺的应用研究
6.
New Stainless Steel Heap Welding Technique for Main Steam Valve Sealing Suface
主蒸汽阀门密封面不锈钢堆焊新工艺
7.
The Second Metallizing Process of Ceramic to Metal Seal
陶瓷-金属封接中的二次金属化工艺
8.
(4)different condition for the seal formation.
(4 )采用循序渐进式的封口化成工艺 ;
9.
The Research and Development of Special Saeling Wax for Bottle Hanndicraft Article;
瓶制工艺品密封专用蜡的研究与开发
10.
Study on Broad Band MMIC Package Design and Related Processes;
宽带MMIC的封装设计及相关工艺研究
11.
Technology of 3D Packaging and TSV
3D封装与硅通孔(TSV)工艺技术
12.
Application of Plasma Cleaning in LED Package Process
等离子清洗在LED封装工艺中的应用
13.
Research on welding fault during LED chips packaging
LED芯片封装工艺中焊接缺陷研究
14.
Packing Technology of High Temperature Pressure Transducer
MEMS耐高温压力传感器封装工艺
15.
Blocking technology with bridge plugs for heavy oil thermal recovery on φ139.7mm casing wells
φ139.7mm套管井热采桥塞封堵工艺
16.
Seal Process Parameters of Edible Film NaAlg /CMC/GLE
NaAlg/CMC/GLE可食膜封合工艺参数的研究
17.
Research & Fabrication of Packaging Technology for High-Power White LED
大功率白光LED封装工艺技术与研制
18.
Optimization of SPC Control Limit Calculation Method of Assembly Process
封装工艺中SPC控制限计算方法的优化