1.
Study on Borer Material Wetting Influence of Low Tin of Micro-alloying Element;
微量合金元素对低锡钎料润湿性影响的研究
2.
Mechanical Properties and Low Cycle Fatigue Life of Solder under Multiaxial Loading;
焊锡钎料的多轴力学性能与低周疲劳寿命研究
3.
Constitutive Description of Tin-Lead Solder 63Sn-37Pb under Multiaxial Loading;
多轴加载下焊锡钎料63Sn-37Pb的本构描述
4.
The Study of Low-Melting-Point Filler Metal for Al-Si-Mg Series Alloys Vacuum Brazing;
Al-Si-Mg系锻铝合金真空钎焊低熔点钎料的研究
5.
Vacuum Brazing Aluminum Matrix Composites with Low Melting Point Solder Development
真空钎焊用低熔点铝基复合钎料的研制
6.
Effects of Surface Oxidation and Reduction on Wetting of Tin-Lead (SnPb) Solder;
表面氧化还原对锡铅（SnPb）钎料润湿的影响
7.
Effect of Cerium on Property and Microstructure for SnAgCu Lead Free Solder;
稀土铈对锡银铜无铅钎料组织性能的影响
8.
Morphologies and characteristics of tin whiskers on surface of SnAgCuCe/Er lead-free solder
SnAgCuCe/Er无铅钎料表面锡晶须的形态及特性
9.
The Development and Study of Low Ag Sn-0.3Ag-0.7Cu-XBi Lead-free Solder;
Sn-0.3Ag-0.7Cu-XBi低银无铅钎料的开发与研究
10.
Investigation on Low Temperature Sn-Zn Base Lead-Free Solder Alloys
低熔点Sn-Zn系无铅钎料的研究
11.
Study on Cu-Ag-Si-Ga Series Brazing Filler Alloys with Low Vapour Pressure
Cu-Ag-Si-Ga系低蒸气压钎料合金研究
12.
Constitutive Description of Temperature and Strain Rate Dependent Tensile Behaviors of Solder;
焊锡钎料温度与应变率相关拉伸性能的本构描述
13.
The Effect of the Thermal Input on the IMC Morphologies in Sn-Ag Based Composite Solder Matrix;
热输入对锡银基复合钎料基体中金属间化合物形态的影响
14.
Investigation on Microstructure and Properties of Low Silver-Containing Cadmium-Free Intermediate Temperature Brazing Filler Metals;
新型低银无镉中温钎料组织性能的研究
15.
Multiaxial Ratcheting Deformation and Low Cycle Fatigue of Lead-free Solder Sn-3.5Ag;
无铅钎料Sn-3.5Ag多轴棘轮变形与低周疲劳研究
16.
Study on preparation and characteristic of low melting-point Aluminum base composite filler metal
低熔点铝基复合钎料的制备及其性能研究
17.
Microstructures and mechanical properties of Sn-30Bi-0.5Cu low-temperature lead-free solder
Sn-30Bi-0.5Cu低温无铅钎料的微观组织及其力学性能
18.
Effect of Bi on Microstructure and Propertities of Sn-0.3Ag-0.7Cu Solder
Bi对低银无铅钎料Sn-0.3Ag-0.7Cu接头组织和性能的影响