1.
The Reversibility of Liquid-liquid Structural Change of Pb-Sn、In-Sn and Pb-Bi Alloys;
温度诱导Pb-Sn、In-Sn和Pb-Bi合金液—液结构转变的可逆性
2.
Rapid Growth of Pb-Sb-Sn and Pb-Sn-Zn Ternary Eutectics under Substantial Undercooling Conditions;
深过冷条件下Pb-Sb-Sn和Pb-Sn-Zn三元共晶的生长规律研究
3.
Preparation and Property of Cu-Sn-P-ZrO_2 Electroless Nanometer Composite Coating;
纳米复合材料镀层Cu-Sn-P-ZrO_2的制备和性质研究
4.
Effects of Sn content on the anticorrosion property of Ni-Sn-P alloy plating
Sn含量对Ni-Sn-P合金镀层耐腐蚀性能的影响
5.
On the Model Checking of SN P Systems Based on Rewriting Logic;
基于重写逻辑的SN P系统模型检测
6.
Study on Electroplating Ni-Sn-P Alloy Coating and Composite Coating
电镀Ni-Sn-P合金及其复合镀层的研究
7.
Modification of Mg_2Si in Mg-Si-Sn Alloys with P
P对Mg-Si-Sn系合金中Mg_2Si的变质
8.
The Study of Sn-Ag and Sn-Zn Multi-Composition System Lead-Free Solder Alloys;
Sn-Ag和Sn-Zn系多组元无铅软钎料研究
9.
Study on Electroless Plating Ni-Sn-P Alloy Coating and Composite Coating;
化学镀Ni-Sn-P合金及其复合镀层的研究
10.
Microstructure and properties of Sn-Zn-Bi-(P,Nd) lead-free solders
Sn-Zn-Bi-(P,Nd)无铅钎料的微观组织及性能
11.
Study on Processes and Performances of Electroless Composite Plating(Ni-Sn-P)-Si_3N_4 Coating
复合化学镀(Ni-Sn-P)-Si_3N_4镀层及其性能研究
12.
Wettability of Sn-Zn,Sn-Ag-Cu and Sn-Bi-Cu Lead-free Solder Alloys with Copper Substrate
Sn-Zn,Sn-Ag-Cu和Sn-Bi-Cu无铅焊锡合金与铜的润湿性
13.
Effect of Sn on the Microstructure and Properties of Ti-Zr-Nb-Sn Alloy System;
Sn元素对Ti-Zr-Nb-Sn合金系组织和性能的影响
14.
Effect of phosphorus content on microstructure and shear strength of Sn-2.5Ag-2.0Ni/ Ni(P) solder joint
磷含量对Sn-2.5Ag-2.0Ni/Ni(P)钎焊接头组织及剪切强度的影响
15.
The Effect of Melt Structure Transition on the Solidification of Binary Sn-Bi and Sn-Sb Alloys
熔体结构转变对二元Sn-Bi和Sn-Sb合金凝固的影响
16.
Study on the Microstructure and Properties of As-Cast Ti-Ni-Sn Materials;
铸态Ti-Ni-Sn合金组织和性能的研究
17.
The Study of Sn-3.0Ag-0.5Cu-XNi Lead-free Solder and Joint Point Microstructure and Property
Sn-3.0Ag-0.5Cu-XNi钎料及焊点组织和性能研究
18.
Effects of Sn on Microstructure and Properties of AlSi7Cu2Mg Alloy
Sn对AlSi7Cu2Mg合金性能和组织的影响