1.
The Analysis and Research of Transfer Molding Technology in Micro-electronics Plastics Packages;
微电子塑封传递模塑成型技术的分析与研究
2.
Study on Optimal Design Method for Micro-electronic Packaging Device Based on Artificial Neural Network
基于人工神经网络的微电子塑封器件的优化设计方法研究
3.
The FEA Simulation of Moisture Diffusion in Electronic Packages;
塑料电子封装件中湿扩散有限元分析
4.
plastic sealed micro-wave low noise diode
塑封低噪声微波二极管
5.
General specification for electronic components plastic packaging equipments
GB/T13947-1992电子元器件塑料封装设备通用技术条件
6.
Simulation of Mechanical Behavior of Plastic Electronic Package under Temperature and Humidity Environment;
温湿度条件下塑封电子器件力学行为的模拟
7.
Optimal design of plastic electronic packaging component based on BP neural network
基于BP神经网络的模塑封电子器件优化设计
8.
Study on Electroless Ni-P Film Plating in Microelectronic Packaging
微电子封装中化学镀Ni-P薄膜研究
9.
The Recent Development of Anisotropic Conductive Adhesive Films for Microelectronic Packaging
微电子封装用各向异性导电胶膜的研究进展
10.
Research Progress in Anisotropic Conductive Adhesives for Microelectronic Packaging
微电子封装用各向异性导电胶的研究进展
11.
Effect of deionized water and NaCl solution on property of electronic component storage
去离子水和5%NaCl溶液浸泡对塑封电子器件的影响
12.
Thermal-Mechanical and Hygroscopic Characteristics of Micro-electronic Packaging Polymer and Its Packaging Reliability Study;
微电子封装高聚物热、湿—机械特性及其封装可靠性研究
13.
The Dispensing Control System and The Research of Its Performance Control for IC Packaging;
微电子封装中点胶控制系统及其性能控制研究
14.
FINITE ELEMENT IMPLEMENTATION TO TIME-DEPENDENT CONSTITUTIVE MODEL OF SOLDER IN MICRO-ELECTRONIC PACKAGING
微电子封装钎料时相关本构模型的有限元实现
15.
Comparison of Cu and Au Ballbonding in Microelectronics Packaging
微电子器件封装中铜与金球键合的比较(英文)
16.
SIZE EFFECT OF MECHANICAL BEHAVIOR OF MINIATURE SOLDER JOINT INTERCONNECTIONS IN ELECTRONIC PACKAGING
电子封装微互连焊点力学行为的尺寸效应
17.
closed cell elastomeric insulation
密封微孔泡沫橡塑隔热材料
18.
ICP-AES Determination of Phosphorus Element in Plastics with Microwave Digestion
微波消解-电感耦合等离子体原子发射光谱法测定塑料中P元素