1.
Study on Broad Band MMIC Package Design and Related Processes;
宽带MMIC的封装设计及相关工艺研究
2.
Development of Packaging Design of High-Power White LED
功率型白光LED封装设计的研究进展
3.
Design of GFP Encapsulation and De-encapsulation Module in EoS
EoS中GFP封装与解封装模块的设计
4.
Design of GFP encapsulation and de-encapsulation in EoS system
EoS系统中GFP封装与解封装的设计
5.
The Detail Design of the Modern Book Cover Design
现代书籍装帧封面设计中的细节设计
6.
Design of the Control System of the Wafer Expanding Device for IC Encapsulation
IC封装的扩晶装置控制系统的设计
7.
The Study on the Design of Equipment and Experiments about Magnetic Fluid Seal;
磁流体密封装置的设计与密封实验研究
8.
Data encapsulation and multi-tiered design go hand in hand.
即，将数据封装和多层设计结合起来。
9.
Design and Manufactue the Packaging of MOEMS Optical Switch;
MOEMS光开关封装的设计与制作
10.
Research and Design of MPEG-4 Encapsulation Method Based on RTP;
基于RTP的MPEG-4封装技术研究与设计
11.
Dispensing System Design and Emulation for RFID Packaging;
面向RFID封装的点胶系统设计与仿真
12.
Design and Encapsulation Ajax Components Based on ASP.NET
基于ASP.NET的Ajax组件的设计与封装
13.
The Parametric Design of Cartridge Mechanical Seal
集装式机械密封参数化设计技术开发
14.
The Design and Realization of Encapsulation and Access Modeling on Modules
模块的封装与调用模型的设计与实现
15.
Design and Test of Capsules for Conditioning of Spent Radioactive Sources
废放射源整备用封装管的设计与检测
16.
Sintering Technology of Power Modules:A Packaging with Good Design
功率模块的烧结技术——良好设计的封装
17.
Design and Realization of GIS Component Based on MapObjects
MapObjects组件二次封装的设计与实现
18.
Mask Subsystem Design of Boiler Model under Matlab/Simulink
Matlab/Simulink环境下锅炉模块封装子系统设计