1.
Application of Modified Bismaleimide Resin in Integrated Circuits Package Substrate
双马来酰亚胺树脂体系在封装基板上的应用
2.
Electrical Simulation Research for IC Package Via
集成电路封装基板过孔电学仿真技术研究
3.
High-density IC Packaging Based on Flexible Printed Circuit
基于挠性基板的高密度IC封装技术
4.
Investigation of Improving HD-PCB Substrate Packaging Quality
改善PCB高密度基板封装质量的研究
5.
Study of the Process of the Flip Chip Package Based on Aluminum Nitride Substrate
以氮化铝陶瓷为基板的倒装式封装工艺研究
6.
Research and Actualization of Flexible Substrate Conveyance Equipment for RFID Packaging;
面向RFID封装的柔性基板输送装置的研究与实现
7.
Thermal Design of High-Power LED Multi-Chip on Board Package
大功率LED多芯片基板上直接封装的热设计
8.
Study on Preparation and Performance of Aluminum Substrate for Heat Dissipation of High-power LED
大功率LED封装用散热铝基板的制备与性能研究
9.
Vibration Analysis and Reliability Research of Packaging on LTCC Substrate
LTCC基板的振动分析及其封装可靠性研究
10.
semi-sealed porcelain basic plate potentiator
半密封瓷基板电位器
11.
a cardboard used by bookbinders to make covers for books.
装订工用来做书的封面的纸板。
12.
Study on the Encapsulation of Organic Light-emitting Diode Materials with AAO;
AAO模板封装有机电致发光材料的研究
13.
New Development about Industry for IC Package Substrate in Taiwan;
发展中的台湾半导体封装用载板产业
14.
Recent Progress of ACF in Flat Panel Display Packaging Applications
应用于平板显示器封装的ACF新进展
15.
Optional mounting configurations (clamp, flange, plate) and tank sealing solutions (packed, mechanical, lip) are available upon request.
可提供多种安装结构（卡盘式，法兰式，板式）和槽罐密封形式（填料密封，机械密封，油密封）。
16.
All light fixtures shall be installed with safety glass panel cemented and sealed to the hood roof.
照明装置上面有安全玻璃面板，并且和柜体密封。
17.
By rubber strips. We've installed the strips along the hatch coamings.
借助于橡胶密封条，将其安装在舱口围板四周。
18.
Study and Development of a Novel Vertical Capsulated Plate Ice Storage Equipment Used in Air-conditioning System;
空调用新型立式封装板蓄冰设备的研究与开发