1.
Numerical Research on Heat Lamination Height to Displacement Ventilation System;
置换通风系统热力分层高度的数值研究
2.
On Characteristics of Thermal Stratification Influenced by Different Buoyancy Sources in Natural Displacement Ventilated Rooms;
受不同浮力源影响的室内自然置换通风热力分层特性探讨
3.
Theoretical Analysis about Interface Oxidation of Thermal Barrier Coatings with Thermodynamics;
热障涂层界面氧化的热力学理论分析
4.
Thermal Stress Analysis of Laser Clad WC/Co Multilayer and Single Layer by Using Finite Element Method;
激光熔覆WC/Co多层过渡涂层与单层涂层的热应力有限元分析
5.
Analysis of Interface Failure of Thermal Barrier Ceramic Coating under Thermo-mechanical Loadings;
热—力联合作用下热障涂层界面破坏分析
6.
Heat Transfer Problem in Buried-Directly Pipes with Multi-Layer Insulation by Boundary Element Method;
多层保温地下直埋热力管道传热的边界元分析
7.
Oxide skin structure and thermodynamic analysis of hot-rolled coiled sheet
热轧卷取板的氧化层结构及热力学分析
8.
The Thermal Stress Analysis of Double-cladding Planar Waveguide Lasers;
双包层平面波导激光器中热应力分析
9.
The improvement of stratified method about thermal stress of functionally gradient material thick plates
梯度厚板热应力分层计算方法的改进
10.
Thermal Stress Analysis and Optimization of SCSP Chip Package
叠层CSP芯片封装热应力分析与优化
11.
The rmodynamic analysis of electrodepositedα-PbO_2 and β-PbO_2 coatings
电沉积α-PbO_2和β-PbO_2镀层的热力学分析
12.
Mechanical Analysis of Free Edge Delamination of Thermoplastic Composite Laminates;
热塑性层合板自由边缘分层的力学行为研究
13.
Thermal Stress Analysis of Stacking Chip Scale Package under Power Load;
功率载荷下叠层芯片尺寸封装热应力分析
14.
Mechanical-thermal-electric Coupling Analysis and Design Optimization of Piezoelectric Multilayered Plates
压电层合板力—热—电耦合分析和优化设计研究
15.
Influence rule of tank pressure on thermal stratification in liquid hydrogen tank
气枕压力对液氢贮箱热分层的影响规律
16.
Mathematical analysis of heat transfer characteristics in laminar falling film under interfacial shear
切应力作用下层流降膜传热特性的数学分析
17.
Residual stress analysis of thermal barrier coatings with substrate curvature
关于基体曲率的热障涂层残余应力分析
18.
Thermal Residual Stress Analysis of TiN Coating on Titanium Alloy Substrate
钛合金基体上TiN涂层的残余热应力分析