1.
The Packaging Structure and Development Trend of Intelligent/smart Power Module
智能功率模块的封装结构和发展趋势
2.
A New Packaging Structure of Stress-Insensitive FBG Temperature Sensor
新型应力不敏感FBG温度传感封装结构
3.
Stress Finite Element Analysis and Structure Optimization in a Stacked Chip Size Package;
叠层CSP封装结构应力有限元分析及结构优化
4.
Study on Red Copper Slice Packaging Structure and Temperature Sensitivity Characteristics for Fiber Grating
光纤光栅紫铜片封装结构及温度敏感特性研究
5.
FEA Method of High-power Semiconductor Encapsulation
大功率半导体器件封装结构的有限元分析
6.
Research on Optimization of Structure and Process Parameters for SiP Based on Interface Strength
基于界面强度的系统级封装结构及工艺参数优化研究
7.
Influences of the Packaging Structure of Platinum Resistance Temperature Sensor on Response Time
铂电阻温度传感器封装结构影响响应时间的因素
8.
Optional mounting configurations (clamp, flange, plate) and tank sealing solutions (packed, mechanical, lip) are available upon request.
可提供多种安装结构（卡盘式，法兰式，板式）和槽罐密封形式（填料密封，机械密封，油密封）。
9.
Optimization of Heat Sink Encapsulated with Phase Change Material for High Temperature Ambient
高温环境下封装有相变材料的热沉结构优化
10.
Analysis of Rationality to the Seal Device Structure of the Rotate Axis Without Moving Leaking Point
旋转轴无动泄漏点的密封装置结构合理性分析
11.
STRUCTURE AND ANALYSIS OF A COMPACT DEWAR BOTTLE PACKAGE OF INFRARED DETECTOR
红外探测器封装微型杜瓦瓶结构与分析
12.
Mechanism & Control Research of Automatic SOT Taping Machine;
SOT自动编带封装机机械结构与控制系统的研究
13.
The Reliability Analysis and Structure Parameter Opimization of Stacked Die Package;
叠层芯片封装可靠性分析与结构参数优化
14.
The Structure and Properties of Al/SiCp Composites Preparated by Pressureless Infiltration for Electronic Packaging;
无压浸渗制备Al/SiCp电子封装材料的结构与性能
15.
A Research on Web Service Based Structured and Encapsulated Workflow;
一种基于Web服务的结构化封装型工作流的研究
16.
Research on the architecture of manufacturing grid with function encapsulation
面向功能封装的制造网格体系结构研究
17.
Blackboard Architecture to Unify Encapsulate Multiple Computer Communications Interfaces
用黑板式结构统一封装多种计算机通信接口
18.
A novel embedded power filter structure research in System-in-Package
系统级封装新型埋入式电源滤波结构的研究