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1.
Important Technique Problems in Silk Screen Printing for Thick Film Integrated Circuits
厚膜集成电路网印应注意的技术问题
2.
Alumina ceramic substrates for thick film integrated circuits
GB/T14619-1993厚膜集成电路用氧化铝陶瓷基片
3.
circuit, integrated hybrid, thin or thick film
混合集成电路,薄膜或厚膜的
4.
Development of 64-route Thick Film Hybrid Integrated Switching Module;
64路厚膜混合集成开关模块的研制
5.
The Reliability-Analysis for HIC and Its Improvement;
厚膜混合集成电路可靠性分析与提高
6.
Thick Film Integration Package Technology for Pressure Sensor
压力传感器的厚膜混合集成封装技术
7.
Research on Thick-film Integrated Technology of Digital Accelerometer;
数字式加速度传感器的厚膜混合集成技术研究
8.
Application of Virtual Instruments Technique in HIC Testing;
虚拟仪器技术在厚膜混合集成电路测试中应用
9.
Thick-film hybrid integrated capacitive accelerometer
基于厚膜混合集成的电容式加速度传感器
10.
The Application of Infrared Imaging Technology on The Thermal Design of Thick Film Hybrid IC
热成像技术在厚膜混合集成电路热设计中的应用
11.
Applied dedicated thick diaphragm and high-power integrated circuit to have high precision on voltage stability and constant current output.
采用专用的厚膜大功率集成电路,具高精度的稳压及恒流输出特牲。
12.
Research on Thick Film Hybrid Integration Fabrication and Program of Micromechanical Accelerometer;
硅微加速度传感器厚膜混合集成方案与工艺研究
13.
circuit, thin or thick film, consisting solely of passive elements
薄膜或厚膜电路,仅由无源元件组成
14.
Control of Thickness and Composition of Pd/Ag Membrane during Layer-by-Layer Electroless Plating
用化学镀法制备Pd/Ag膜时膜厚和组成的控制
15.
passive hybrid film integrated circuit
无源混合膜集成电路
16.
film mounted ic
膜载组装的集成电路
17.
Generic specification for film integrated circuits and hybrid film integrated circuits
GB/T8976-1996膜集成电路和混合膜集成电路总规范
18.
Preparation of PVDF Hydrophobic Membrane and Study on Membrane Distillation Integrated Technique;
PVDF疏水膜制备及膜蒸馏集成技术研究