1.
Monocrystalline silicon ascut slices and lapped slices
GB/T12965-1996硅单晶切割片和研磨片
2.
Study on CAD/CAM Technology of Non-Ferrous Metals Mould in Electrolytic Grinding and Development of a New Soft Abrasive Slice;
不锈钢模具电解研磨CAD/CAM的研究和研磨片的研制
3.
Development of Soft Abrasive Wheel Used in Ultra-precision Grinding Silicon Wafer
超精密磨削硅片的软磨料砂轮的研制
4.
The Fractal Dimension of Profile of Chip,Blocky and Laminar Wear Particles
片状磨粒、块状磨粒和层状磨粒轮廓分形维数研究
5.
Study on Single Crystal MgO Substrates Lapping and Its Damage;
单晶MgO基片研磨工艺及其损伤研究
6.
indexable insert tip dual-face lapping machine
可转位刀片双端面研磨机
7.
Research of Grinding Capability of Coated Abrasive Belt in Grinding the Material of Gas Turbine Blades;
燃气轮机叶片材料砂带磨削性能研究
8.
Study on Simulation and Experiment of Ground Wafer Shape in Rotational Grinding Method;
硅片自旋转磨削面型仿真与实验研究
9.
Research the Key Technology of Silicon Wafer's Grinding Device Based on Silicon Wafer Rotating;
硅片自旋磨削试验台关键技术的研究
10.
Study on CAD/CAM System for NC Belt-grinding of Blade Surface;
叶片型面数控砂带抛磨CAD/CAM系统研究
11.
A Simulant Experiment Study of the Silicon s Mechanism in the CMP;
单晶硅片CMP磨损机理的模拟试验研究
12.
Study of Creep Grinding on Superalloy for Turbine Blade
高温合金涡轮叶片缓进磨削工艺研究
13.
Study on Removal Mechanism of Ductile-Mode Grinding in 300mm Silicon Wafer Surface Grinding Process
300mm硅片表面延性磨削机理研究
14.
Research on the Polishing of Silicon Wafer by Fixed Abrasive Pad
固结磨料抛光垫抛光硅片的探索研究
15.
Study on Soft Abrasive Wheel Preparation and Properties of Sapphire Substrate Grinding
磨削蓝宝石基片的软磨料砂轮的研制及性能研究
16.
Study on the Mechanism of Refining Plate to Influence of MDF Fiber Separation Quality;
热磨机磨片对中密度纤维板纤维分离质量影响机理的研究
17.
The Experimental Study on Cutting and Wear Performance of Fine Grinding Cemented Carbide Numerical Control Tools
精磨硬质合金数控刀片切削与磨损性能的实验研究
18.
Approach to Semi-fixed Abrasive Grinding Plate on Surface Lapping Copper Substrates of Amorphous Ni-Pd-P Alloy Films
半固着磨具在非晶态Ni-Pd-P合金薄膜铜片衬底精密研磨中的应用