1.
Analysis of the Interconnect in Microwave Multi-chip Module by Parallel FDTD Technique;
并行FDTD技术分析微波多芯片组件的互连效应
2.
Performance of a silicon-based embedded MMCM package
一种硅埋置型微波多芯片组件封装的电性能
3.
Development of a Miniature T/R Front-end Using Microwave Multi-Chip Module Technology
基于多芯片组装技术的小型微波收发前端研制
4.
Characteristics simulation of MEMS packaging using multichip modules technology
基于微机械系统的多芯片组件封装和特性模拟(英文)
5.
Study on Thermal Placement Optimization of Stacked 3D-MCM Based on Thermal Superposition Model
基于热叠加模型的叠层3D多芯片组件芯片热布局优化研究
6.
Warpage of Three-Dimensional Multi-Chip Module Based on Embedded Substrate
基于埋置式基板的三维多芯片组件的翘曲研究
7.
Design and Simulation of Microfluidic Chips Based on Multimode Interference Waveguide for Measuring Refractive Index of Liquid
多模干涉光波导型微流控液体折射率监测用芯片的设计
8.
Patterning different cells based on microfluidics and self-assembled monolayers
一种基于微流控芯片和电化学自组装单层的多细胞表面构图方法
9.
Design and transmission characteristics simulation in MCM placement and routing
多芯片组件高速电路布局布线设计及信号传输特性仿真
10.
Finite Element Simulation of Reliability and Life Prediction on Solder Joint of MCM;
多芯片组件（MCM）焊点可靠性的有限元模拟与寿命的预测
11.
two-bit wide slice
二位式芯片 -微机
12.
Ultrasonic Fusion Bonding for Polymer Microfluidic Chips
聚合物微流控芯片超声波熔融键合技术研究
13.
Research on the Ultrasonic Bonding Method for Polymer Microfluidic Chips
聚合物微流控芯片超声波键合方法研究
14.
Multi-chip Array Combination White Light LED Seal Research
多芯片阵列组合白光LED封装研究
15.
Development of Recognized Software on Multi-tumor Protein Chip Analysis System V1.0
多肿瘤蛋白芯片肿瘤判别软件的研制
16.
An integrated circuit that contains the entire central processing unit of a computer on a single chip.
微处理机一个芯片上的包含有一个计算机的全部中央处理组件的集成电路
17.
From laptops to lasers, from microchips to megabytes,
从笔记本电脑到激光，从微芯片到百万位元组，
18.
The Design of Loop Filter Module in a Multi-mode Video Decoder Chip;
多模视频解码芯片中环路滤波模块的设计