1.
An Overview of Non destructive Inspection in Flip Chip Packaging
倒装焊芯片封装中的非接触检测技术
2.
Research on welding fault during LED chips packaging
LED芯片封装工艺中焊接缺陷研究
3.
Thermal Stress Analysis and Optimization of SCSP Chip Package
叠层CSP芯片封装热应力分析与优化
4.
Progress of Anisotropic Conductive Adhesive for Flip Chip Packaging
倒装芯片封装材料—各向异性导电胶的研究进展
5.
The Reliability Analysis and Structure Parameter Opimization of Stacked Die Package;
叠层芯片封装可靠性分析与结构参数优化
6.
Research on Friction Analysis and Compensation for the High-Speed & High-Accuracy IC Packaging Platform;
高速高精芯片封装平台的摩擦分析及补偿研究
7.
Research on Machine Vision Alignment Technology of Area Array Packaging;
面阵列芯片封装设备中的视觉定位技术
8.
Package and Electrostatic Discharge Failure Analysis of Power Semiconductor Device Chip
功率器件芯片封装和静电放电失效分析
9.
Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages.
集成电路倒装芯片封装中半导体芯片及载体之间形成可靠联接所用焊料中的铅。
10.
Flexible Bumping Technology and Applications in MEMS Flip Chip Packaging;
MEMS器件倒装芯片封装中的柔性化凸点制备技术及其应用
11.
Flip Chip will be a New Method of Packaging Technology
倒装芯片将成为封装技术的最新手段
12.
Bumping Technology for MEMS Flip Chip Packaging;
MEMS封装中的倒装芯片凸点技术
13.
Area Array Package--BGA/CSP & flip chip
BGA/CSP和倒装焊芯片面积阵列封装技术
14.
The Main Factors Causing Die Crack in IC Assembly Process
IC封装中引起芯片裂纹的主要因素
15.
Multi-chip Array Combination White Light LED Seal Research
多芯片阵列组合白光LED封装研究
16.
Comprehensive Comparison Between FC and CSP and Their Development Anticipation
倒装片封装与芯片规模封装的综合比较及其发展前景
17.
Direct Chip Attachment Packaging of a 2-D Thermal Flow Sensor
采用芯片直接安装技术封装的风速风向传感器
18.
Thermal Stress Analysis of Stacking Chip Scale Package under Power Load;
功率载荷下叠层芯片尺寸封装热应力分析