1.
Measurement and de-embedding of on-chip spiral inductors on Si substrates
硅基射频螺旋电感的在片测试和剥离方法
2.
Application for Paper Tensile Strength Based on Single-chip
单片机在纸张抗拉强度测试中的应用
3.
ATE Test Solution for RFID Device;
RFID芯片在ATE上测试解决方案的研究
4.
The application of a new single chip microcomputer in the temperature testing system;
AT89C2051单片机在温度测试系统中的应用
5.
Applications of SN74ACT8990 in Digital Circuits Test
SN74ACT8990芯片在数字电路测试中的应用
6.
Application of MSP430 in testing and measuring system
MSP430单片机在测试系统中的应用
7.
Applications of Monolithic Integrated Circuits in Temperature Test System
单片机在温度数据测试系统中的应用
8.
Mechanical Test Wafer- A silicon wafer used for testing purposes.
机械测试晶圆片-用于测试的晶圆片。
9.
Application of Single Chip Microcomputer in Acceleration test of Assistant Flying Jamming
单片微机在助飞干扰器加速度测试中的应用
10.
Application of Single Chip Microprocessor in Operational Amplf ier Measuring System
单片机在运算放大器测试系统中的应用
11.
The Computer Method Applied to Engine Blade Vibration Experiment on Frequency Testing;
计算机技术在叶片振动频率测试中的应用
12.
Research on Specification and Slicing in Generating Test Cases for Component-Based System;
规约和切片技术在组件测试用例生成中的研究
13.
The Application of Singlechip in the Anti-damage Testing Technology for Crop on Nitrogenous Content;
单片机在作物含氮量无损测试技术中的应用
14.
HPCC Diagnostic Test and Results Analysis on IBM BladeCenter Cluster
HPCC在IBM刀片机群上的诊断测试与结果分析
15.
In our country's English language testing, there exist the problems such as one-sided view of language testing's function and not-scientific-enough testing method.
我国英语测试存在的问题是片面理解测试的作用和测试方法不够科学。
16.
Fie specimens of each thickness are tested after conditioning for48 hours at23 degrees C and50% RH.
每一厚度取5个试片为一组在23℃50%放置48小时后再测试。
17.
Fie specimens of each thickness are tested after conditioning for7 days at70 degrees C.
同一厚度另取5个试片为一组在70℃放置7天后再测试。
18.
The RF Wafer Test Technology with SoC Tester
基于SoC测试系统的RF圆晶片测试技术