1.
Research on precise alignment for full automatic solder paste printer
![点击朗读](/dictall/images/read.gif)
全自动视觉锡膏印刷机精密对准研究
2.
Research of a Build-in Defect Inspection Algorithm for Lead-free Solder Paste Printing
![点击朗读](/dictall/images/read.gif)
内置无铅锡膏印刷机的检测算法研究
3.
Applications of Fieldbus Control System for the Integrated Circuit Board Paste Printer
![点击朗读](/dictall/images/read.gif)
集成电路板锡膏印刷机现场总线系统应用
4.
Research on structural optimization of the frame of high-accuracy solder paste printer
![点击朗读](/dictall/images/read.gif)
高精度锡膏印刷设备的机架结构优化研究
5.
When the material is fully contained within the printing system, concerns about handling, drying out, moisture absorption or waste are eliminated.
当物料完全包括在锡膏印刷系统,关注处置,干燥,吸潮和减少浪费。
6.
In this process, a standard stencil printing technique is used to print solder paste directly onto silicon wafers( Figure4).
在这个过程,标准印刷技术用来把锡膏直接印刷到硅晶片上。
7.
The Study Based on Characteristics of Stencil Opening Hole in the Solder Paste Deposition Process;
基于模板特性影响焊膏印刷落锡量过程控制研究
8.
MThoe mProecnestsu Cmon-ttryolp oef Printer
![点击朗读](/dictall/images/read.gif)
Momentum型印刷机的焊膏印刷工艺控制
9.
Application of SPC in Quality Control of Solder Paste Printing
![点击朗读](/dictall/images/read.gif)
SPC在焊膏印刷质量控制中的应用
10.
Viscosity-A Key Factor for Quality Control in Solder Paste Printing
![点击朗读](/dictall/images/read.gif)
黏度——决定焊膏印刷质量的关键因素
11.
an alloy of tin and lead and antimony used to make printing type.
![点击朗读](/dictall/images/read.gif)
含锡、铅和锑的合金,用于制印刷铅字。
12.
The art, method, or business of printing.
![点击朗读](/dictall/images/read.gif)
印刷业印刷品,印刷方法或印刷业
13.
To produce(a print or an impression) from type.
![点击朗读](/dictall/images/read.gif)
印刷通过印刷铅字制造(印刷品或印记)
14.
microform reader-printer
![点击朗读](/dictall/images/read.gif)
缩微印刷品阅读印刷器
15.
brushing printing
![点击朗读](/dictall/images/read.gif)
刷印(刷帚花版印花)
16.
polychrome printing
![点击朗读](/dictall/images/read.gif)
套色印刷, 多彩印刷法
17.
A print made from such a block.
![点击朗读](/dictall/images/read.gif)
印版印刷品用印版印出的印刷品
18.
Pb-free solders ? Sn-Bi-Zn based with our own patent and their modification to fit for package applications.
无铅焊锡—锡铋锌系无铅焊锡,材料设计、开发,焊料(锡球、锡膏)开发等。