1.
Study on damage failure pattern and microstructure analysis of target plate of laminated armor Al alloy
铝合金多层板靶板损伤形式及其微观组织分析
2.
Application and Development of HDI Multi-layer Laminated Copper Foil Production Technology
HDI多层板覆铜箔板生产技术的应用与开发
3.
Enhance Interlayer Bond Strength of Multilayer Boards for Lead-Free Soldering
![点击朗读](/dictall/images/read.gif)
提高和改善“无铅化”多层板层间的结合力
4.
sequentially-laminated mulitlayer
![点击朗读](/dictall/images/read.gif)
顺序层压多层印制板
5.
differential gloss sheet
![点击朗读](/dictall/images/read.gif)
多层装饰的差色光亮板
6.
multi-plate trim
![点击朗读](/dictall/images/read.gif)
多层叠板工节流组件
7.
multiplate freezer
![点击朗读](/dictall/images/read.gif)
多层平板式冻结装置
8.
gussetted multiwall paper bag
![点击朗读](/dictall/images/read.gif)
装有角撑板的多层纸袋
9.
ALIVH multilayer printed Board
![点击朗读](/dictall/images/read.gif)
层间全内导通多层印制板
10.
Uniformity of fluidized solids heights in multistage sieve tray fluidized bed
![点击朗读](/dictall/images/read.gif)
多层筛板流化床料层高度均匀性研究
11.
multilayer and high density fine-pitch printed circuit board
![点击朗读](/dictall/images/read.gif)
多层和高密度细线距的印刷电路板;多层和高密度细线距的线路板
12.
Ground Heating Flooring and Development Trend of Multi-ply Solid Wood Parquet Flooring
![点击朗读](/dictall/images/read.gif)
地暖地板及多层实木复合地板的发展趋势
13.
Test method for insulation resistance within inner layers of multilayer printed boards
![点击朗读](/dictall/images/read.gif)
GB/T4677.17-1988多层印制板内层绝缘电阻测试方法
14.
Test method for insulation resistance between layers of multilayer printed boards
![点击朗读](/dictall/images/read.gif)
GB/T4677.18-1988多层印制板层间绝缘电阻测试方法
15.
The Multi-storey Formwork Supports System and Its Safety Research for High Rise Building;
![点击朗读](/dictall/images/read.gif)
高层建筑多层模板支撑体系及其安全性研究
16.
Free vibration characteristic of plain woven fabric laminates with multiple delaminations
![点击朗读](/dictall/images/read.gif)
含多分层损伤平面编织层合板的振动特性
17.
Safety control of high rise building multi-storey formwork supports system
![点击朗读](/dictall/images/read.gif)
高层建筑多层模板支撑体系安全性控制方法
18.
Reliability Study on Multi-layer Substrates of MCM and Thick-film Resistors;
![点击朗读](/dictall/images/read.gif)
MCM多层互连基板及膜电阻可靠性研究