1.
Simulation Study of Microchannel Distortion of Polymeric Microfluidic Chip with Bonding Technique
聚合物微流控芯片键合微通道变形仿真研究
2.
Impact of the chip bonding layer material on the thermal resistance of power LED
芯片键合层材料对功率型LED热阻的影响
3.
The feeder mechanism of a die bonder and its virtual prototype
芯片键合机传送机构及其虚拟样机研究
4.
Ultrasonic Fusion Bonding for Polymer Microfluidic Chips
聚合物微流控芯片超声波熔融键合技术研究
5.
Research on the Ultrasonic Bonding Method for Polymer Microfluidic Chips
聚合物微流控芯片超声波键合方法研究
6.
Research on Hot Embossing and Bonding for Fabrication of Plastic Microfluidic Chips;
塑料微流控芯片微通道热压成形及键合工艺研究
7.
Design and Fabrication of Micro Energy Director on Microfluidic Chip for Ultrasonic Bonding;
微流控芯片超声波键合能量引导微结构设计与工艺
8.
Simulation and Experiments Research on the Ultrasonic Bonding Mechanism of Microfluidic Chips;
塑料微流控芯片超声波键合机理的仿真与实验研究
9.
A Brief Study on the Systematical Structure and Pivotal Techniques of a Micro-INS Integrated Navigation
微惯性组合导航芯片体系结构及其关键技术研究
10.
Effect of Bonding Methods on Polydimethylsiloxane-Based Droplet Microfluidic Devices
键合方法对聚二甲基硅氧烷液滴型微流控芯片的影响
11.
Studies on Key Processes and Techniques of PDMS Microfluidic Chips;
PDMS微流控芯片关键工艺技术研究
12.
Intelligence controling chip HD7279A of keyboard displaying and its application;
键盘显示智能控制芯片HD7279A的应用设计
13.
Control Chip BC7281A for Keyboard and Display and its Application;
键盘显示控制芯片BC7281A及其应用
14.
Intelligent Control Chip HD7279 for Keyboard and Display and Its Application Example;
键盘显示智能控制芯片HD7279及应用实例
15.
The Pivotal Module Physical Design of YHFT-DX
YHFT-DX芯片关键模块的物理设计
16.
film carrier bonding
膜形载体上芯片接合
17.
chip and wire hybrid ic
芯片 细线混合电路
18.
The Design of Keyboard in Application System of Single Chip Computer by Pulse Dial Chip;
脉冲拨号芯片实现单片机应用系统键盘的设计