1.
System-in-Package (SiP) Random Vibration Analysis
系统级封装（SiP）的随机振动分析
2.
Study on System-in-Package Technology of MEMS Air Pressure Sensor;
MEMS气体压力传感器的系统级封装（SiP）技术研究
3.
A novel embedded power filter structure research in System-in-Package
系统级封装新型埋入式电源滤波结构的研究
4.
Research on Optimization of Structure and Process Parameters for SiP Based on Interface Strength
基于界面强度的系统级封装结构及工艺参数优化研究
5.
The measurement of a Novel embedded power filter structure in System-in-Package
系统级封装中一种新型埋入式电源滤波结构的测量
6.
Design of GFP encapsulation and de-encapsulation in EoS system
EoS系统中GFP封装与解封装的设计
7.
Design of the Control System of the Wafer Expanding Device for IC Encapsulation
IC封装的扩晶装置控制系统的设计
8.
Microsystem Technology (Serials Four)──Packaging Technologies
微系统技术（连载四）──封装技术
9.
Research on Soft Measurement of Internal Temperature and Relative Humidity in Sealed Packages;
密封包装箱内温湿度软测量系统研究
10.
Dispensing System Design and Emulation for RFID Packaging;
面向RFID封装的点胶系统设计与仿真
11.
Water Seal Arrangement for Flare Gas Recovery and Its Improvement;
火炬气回收装置水封阀系统应用分析
12.
Transform of Controlling System of Al Tube Sealing Tail Machine of PLC
PLC铝管灌装封尾机控制系统的改造
13.
Mask Subsystem Design of Boiler Model under Matlab/Simulink
Matlab/Simulink环境下锅炉模块封装子系统设计
14.
the seal of the air-balancing cylinder adopts multi-stage seal;
气平衡缸密封部位采用多级密封装置 ;
15.
Study of Insulated Potting and Encapsulation System to Gasoline Engine Ignition Coil;
汽油机点火线圈的绝缘封装及其灌封系统的研究
16.
The Investigation of 2-DOF High-speed and High-precision Positioning System for IC Packaging;
面向IC封装的两自由度高速精密定位系统研究
17.
Research on Modeling, Control and Implementation of Dispensing System for IC Packaging;
面向半导体封装的点胶系统建模、控制与实现
18.
Design and Implementing of the Machine Vision System in RFID Tag Package Equipments;
RFID标签封装设备中机器视觉系统设计与实现