1.
Microsystem Technology (Serials Four)──Packaging Technologies
微系统技术（连载四）──封装技术
2.
Flip Chip will be a New Method of Packaging Technology
倒装芯片将成为封装技术的最新手段
3.
Area Array Package--BGA/CSP & flip chip
BGA/CSP和倒装焊芯片面积阵列封装技术
4.
Research and Design of MPEG-4 Encapsulation Method Based on RTP;
基于RTP的MPEG-4封装技术研究与设计
5.
Research on RF MEMS Switch Packaging;
RF MEMS开关封装技术的研究
6.
DLL Packaging Technique in MIS Foreground Application Development;
MIS前台应用开发中的DLL封装技术
7.
Research on the WSRF-based Manufacturing Resources Encapsulation in Manufacturing Grid
基于WSRF的制造网格资源封装技术研究
8.
Efficiency analysis of IP over DVB encapsulation protocol
IP over DVB封装技术效率分析
9.
Device level vacuum packaging technologies of MEMS gyroscopes
MEMS陀螺仪器件级真空封装技术
10.
Reasearch on Encapsulation Technology Reliability of High Power White-Light LED
大功率白光LED封装技术可靠性研究
11.
Research on encapsulation of service component based on service-oriented architecture
基于SOA的服务构件封装技术研究
12.
High-density IC Packaging Based on Flexible Printed Circuit
基于挠性基板的高密度IC封装技术
13.
Thick Film Integration Package Technology for Pressure Sensor
压力传感器的厚膜混合集成封装技术
14.
An Overview of Non destructive Inspection in Flip Chip Packaging
倒装焊芯片封装中的非接触检测技术
15.
Bumping Technology for MEMS Flip Chip Packaging;
MEMS封装中的倒装芯片凸点技术
16.
Technology of 3D Packaging and TSV
3D封装与硅通孔(TSV)工艺技术
17.
The Parametric Design of Cartridge Mechanical Seal
集装式机械密封参数化设计技术开发
18.
Sintering Technology of Power Modules:A Packaging with Good Design
功率模块的烧结技术——良好设计的封装