1.
Bond-Wire Matching Techniques of InGaP/GaAs HBT Power Amplifier
InGaP/GaAs HBT功率放大器的键合线匹配技术
2.
Study on a New Al-1%Si Bonding Wire for Encapsulation of Integrate Circuit;
集成电路封装用新型Al-1%Si键合线的研制
3.
Research on the Factors Affecting the First Bond of Ultra-Fine Pitch Wire Bonding Process;
超细间距引线键合第一键合点影响因素研究
4.
Design and synthetic route of bonding agents containing polyether of heretocycle amide
聚醚环酰胺键合剂的设计及合成路线
5.
On-Line Examination Method of Bonding Strength Measurement in Silicon MEMS Devices
硅MEMS器件键合强度在线检测方法
6.
Research of Ultrasonic Power Supply in Wire Bonding Based on FPGA
基于FPGA的引线键合超声电源的研究
7.
glucosidic linkage
糖苷键[合],苷键[合]
8.
Design of High-frequency Ultrasonic Transducer for Wire Bonding and Research on Motion Control of Bond Head
引线键合高频超声换能器的设计和键合头运动控制研究
9.
Study on Some Key Problems of Synthetic Aperture Radar Antenna Technologies
合成孔径雷达天线技术的若干关键问题研究
10.
Research on Micro Vision System for Automatic MEMS Wire Bonding;
面向MEMS自动引线键合的显微视觉系统研究
11.
The Research of the Image Recognition System for Intelligent IC Wire Bonder;
智能IC引线键合机图像识别系统的研究
12.
Research of Methods for Bonds Inspection of Automatic Wire Bonder;
全自动引线键合机产品检测方法的研究
13.
Research on Key Technology of the Convergence between RFID and Wireless Network;
RFID与无线网络融合关键理论和技术研究
14.
Analysis on Key Technologies of Multi-modal Passenger Transportation Based on PDL;
基于客运专线的旅客联合运输关键技术分析
15.
Key Technologies of Bimetal Tube Expanded Forming and the Equipment Research
双层管线形胀合力学研究及关键因素分析
16.
Software Analysis and Design of the Fully Automatic Gold Wire Bonder
全自动引线键合机系统软件分析与设计
17.
Investigation of Factors Affecting Bonded Ball Hardness on Copper Wire Bonding
铜引线键合中影响焊球硬度因素的研究(英文)
18.
Effect of Substrate Surface Smoothness on Thin Al Wire Wedge Bonding Strength
平整度对细Al丝超声引线键合强度的影响