1.
Analysis on the Relation between EMC Property and Packaging Defect
浅析环氧塑封料性能与器件封装缺陷
2.
Thermal Analysis of LED Packages based on Heat Pipe Heat Sink
基于热管散热的LED器件封装热分析
3.
Current Situation of High-Power LED Encapsulant
大功率LED器件封装材料的研究现状
4.
Research and Development of Planar Waveguide Circuit's Packaging Software
平面波导器件封装工艺软件的研究与开发
5.
PACKAGING OF WAVEGUIDE DEVICES BASED ON BULK SILICON MEMS TECHNOLOGY
基于体硅微机械工艺的光波导器件封装技术
6.
Ultrasonic Bonding System Applied to the Package of Polymer Micro Parts;
应用于聚合物微器件封装的超声波键合系统
7.
Study on Low Temperature Glass Frit Bonding for MEMS Device
MEMS器件封装的低温玻璃浆料键合工艺研究
8.
Comparison of Cu and Au Ballbonding in Microelectronics Packaging
微电子器件封装中铜与金球键合的比较(英文)
9.
FEA Method of High-power Semiconductor Encapsulation
大功率半导体器件封装结构的有限元分析
10.
Mechanical property of UV curable adhesive bonding in packaging of fiber array waveguide device
阵列波导器件封装用UV胶粘接力学性能分析
11.
Effect of Hydrogen on the Reliability of Microelectronic Devices
氢对金属封装密封元器件可靠性的影响
12.
Device level vacuum packaging technologies of MEMS gyroscopes
MEMS陀螺仪器件级真空封装技术
13.
A technique of converting web documents into component based on wrapper
一种基于封装器的Web文档构件化技术
14.
Electron-induced Damage of CMOS with Shielded Packages
屏蔽材料封装CMOS器件的电子辐照损伤
15.
Reliability of SOP Component Solder Joint
小尺寸封装(SOP)器件焊点可靠性研究
16.
Thermal Performance Research on Electronics Packaging Component Based on Flip Bonding;
基于倒装焊接的电子封装器件热性能的研究
17.
Moisture Absorption Property of Material and Moisture&Thermal Affects on Package's Reliability
封装材料的吸湿特性及湿、热对封装器件可靠性的影响
18.
General specification for electronic components plastic packaging equipments
GB/T13947-1992电子元器件塑料封装设备通用技术条件