1.
Effects of Annealing and Drawing on Properties of Single Crystal Copper Bonding Wire
冷变形和热处理对单晶Cu键合丝性能影响
2.
Study on Giant Magneto-impedance Effect in Electroless Plated CoNiP/Cu Composite Wires;
化学镀CoNiP/Cu复合结构丝巨磁阻抗效应研究
3.
Influence of pH on GMI Effect of Electroplated FeNi/Cu Composite Wires
pH值对电沉积FeNi/Cu复合丝巨磁阻抗性能的影响
4.
Study on the Application of Bonding Technology for Cu/Sn Isothermal Solidification in MEMS Hermetic Package;
Cu/Sn等温凝固键合在MEMS气密封装中的应用研究
5.
Mechanism and Process of Cu-Sn Bonding for Wafer Level MEMS Packaging
MEMS圆片级封装用Cu-Sn低温键合机理与工艺研究
6.
Study on the Preparation and Ball Bonding Process for the High-Performance Copper Bonding Wire
高性能键合铜丝的制备及其球键合工艺研究
7.
Gold wire for semiconductor devices lead bonding
GB/T8750-1997半导体器件键合金丝
8.
Fine aluminum-1% silicon wire for semiconductor lend-bonding
GB/T8646-1998半导体键合铝--1%硅细丝
9.
Study on the Key Techniques of Large-Capacity Complex Spinning Component
大容量复合纺丝组件的关键技术研究
10.
Cu/Sn Isothermal Solidification Technology for Wafer-level Hermetic Packaging of MEMS;
Cu/Sn等温凝固键合技术在MEMS圆片级气密封装中的应用
11.
Research on Design Method and Properties of Eletronic Packaging Single Crystal Copper Wire;
电子封装单晶铜键合丝制备工艺及性能研究
12.
The Design and Analysis of Millimeter-wave Microstrip Bonding Wires for Wide-Bandwidth Matching Interconnection
毫米波微带键合金丝宽带匹配互连分析设计
13.
SPC Quality Control for Gold Wire-bonding
统计过程控制用于金丝键合质量控制研究
14.
Effect of Substrate Surface Smoothness on Thin Al Wire Wedge Bonding Strength
平整度对细Al丝超声引线键合强度的影响
15.
Application of Novel Image Matching Algorithm in Golden Wire Bonder
新图像匹配算法在金丝球引线键合机中的应用
16.
Intermetallic Compounds Formation and Reliability on Bonding Joints of Copper Wire and Gold Wire with Aluminum Alloy Pad;
铜及金丝与铝合金焊盘键合的金属间化合物生长和可靠性
17.
In term of inoculated hypha technology, the key point for successful is to breed and scan the real inoculated growth line.
菌丝融合技术中，如何培养筛选出真正的融合生产线，是菌丝融合技术成败的关键。
18.
Active Brazing AlN Ceramic and Mo-Cu Alloy Using Ag-Cu-Ti
Ag-Cu-Ti活性法封接AlN陶瓷与Mo-Cu合金