1.
Reliability of plated through hole (PTH) has close relationship with technology parameters during manufacture process.
镀通孔的可靠性与制造过程工艺参数有非常密切的关系。
2.
Micro-via Filling and Through Hole Plating in one Process in Vertical Line
垂直电镀线盲孔和通孔同步电镀工艺
3.
Cupric Sulfate Plating Process Cu-BRITE TFⅡ for Through-Hole and Via Filling Plating
导通孔和通孔填孔镀用的CuSO_4电镀工艺“Cu-BRITE TFⅡ”
4.
Research on acidic copper additives used in through-hole plating of PCB manufacture
印制电路板中通孔电镀铜添加剂的研究
5.
To galvanize or plate(metal)by immersion.
电镀通过浸泡镀涂金属
6.
To coat with tin, either by dipping or electroplating.
镀锡在…镀锡，通过浸染或电镀的方式
7.
Study on Sealing Technology and Corrosion Resistance of Ni-P Electroless Deposit
化学镀镍磷合金镀层封孔工艺及耐蚀性能研究
8.
Causes and Reduction Countermeasures of Porosity in Electrolytic Tinplate
电镀锡钢板孔隙成因及降低对策研究
9.
Study of the Technology to Enhance the Pit Corrosion Resistance of the Ni-P Electroless Deposit in Brine Medium;
海洋环境中增强化学镀镍磷合金镀层耐孔蚀性能的工艺研究
10.
Pure nickel deposits were obtained from the traditional Watt nickel plating bath by pulse electroplating .
采用传统的瓦特镀液通过脉冲电镀制得纯镍镀层。
11.
The electrographic test method of plating porosity for printed boards
GB/T4677.9-1984印制板镀层孔隙率电图象测试方法
12.
Test method for plating porosity of printed boards--The gas exposure method
GB/T4677.21-1988印制板镀层孔隙率测试方法气体暴露法
13.
THE PRELIMINARY ANALYSIS OF PRIMARY FACTORS INFLUENCING THE PROPERTIES OF THE LONG BORE IRON PLATING LAYER
影响深孔镀铁层性能主要因素的初步分析
14.
Research on High-Speed Drilling and Marking Laser Instrument for ETL Line of Cold Rolling;
冷轧镀锡生产线高速激光孔标仪的研制
15.
The Design and Application Research of the Deep Hole Chrome Plating Monitoring System Based on WinCC;
基于WinCC的深孔镀铬监控系统设计与应用研究
16.
Impact of Second Sealing-Treatment on Corrosion Resistance of Double Electroless Ni-P Deposits
二次封孔对化学镀双层镍磷合金耐蚀性的影响
17.
Drilling method of pin hole: the pin hole shall be predrilled by supplier prior to hot dip galvanization.
销钉孔的钻法：销钉孔应为供应商在热镀锌预钻好。
18.
The air passage is called the air bleed.
空气通道叫通气孔。