1.
MEMBRANE COMPONENTS LOCATION OPTIMIZATION MODEL AND ALGORITHM IN RO SYSTEM
反渗透系统中膜元件位置优化的模型及算法
2.
Aging and humidity effects of optical surface deformation after deposition
镀膜元件面形变化的时间效应和湿度效应
3.
The temperature rise in films at the repeat rate pulse laser irradiation determined based on finite element method
重复频率脉冲激光辐照下光学薄膜元件温升的有限元分析
4.
Study on Thermal Absorption of Thin Film Coatings Irradiated by Infrared CW Laser
红外连续波激光辐照下光学薄膜元件的热吸收特性研究
5.
circuit, thin or thick film, consisting solely of passive elements
薄膜或厚膜电路,仅由无源元件组成
6.
Device Processing: Etching. Surface passivation; dielectric films.
元件制程：蚀刻，表面钝化，介电材料薄膜。
7.
Properties of MnWO_4-Li_2WO_4 system thick film humidity sensors
MnWO_4-Li_2WO_4系厚膜湿敏元件的性能
8.
Study of SnO_2 Formaldehyde Gas Sensor Based on Plane Technology
平面工艺SnO_2薄膜甲醛气敏元件的研究
9.
Trapezoid Heating Elements in Plate Film Evaporators
板式自由流降膜蒸发器中的梯形加热元件
10.
The Research of Multilayer Polarizing Components in Extreme Ultraviolet and Soft X-Ray;
极紫外与软X射线多层膜偏振元件研究
11.
Investigations of Humidity Sensors of Nano-BaTiO_3 and Organic Composite Material;
纳米钛酸钡与有机复合膜湿敏元件的特性研究
12.
Study on the Hydrothermal Synthesis of SnO_2 Nanoparticles and Fabrication of SnO_2 Thick-film Gas Sensor;
水热法制备纳米SnO_2及厚膜气敏元件初探
13.
Study and Fabrication of Humidity Sensor of Zirconia Film on Silicon Substrate;
硅衬底氧化锆薄膜湿敏元件研制及特性研究
14.
Research on the Influence of Sintering Temperature on the Thick Film SrTiO_3 Oxygen Sensor
烧结温度对SrTiO_3厚膜氧敏元件的影响研究
15.
Study on Formaldehyde Gas Sensitivity of Optical Waveguide Sensing Element Based on MB/PVP Thin Film
MB/PVP薄膜光波导传感元件对甲醛的气敏性研究
16.
Electrical Properties of Nanometer Titania Tilm Humidity Elements
纳米氧化钛薄膜湿敏元件的电学特性研究
17.
The Evaluation and Factor Analysis of the Effective Diameter of Membrane Component of Pressure-reducing Valve Based on Finite Element Method
基于有限元法的减压阀膜片元件有效直径的计算及影响因素分析
18.
Methods A silver wafer with a basis resonance frequency 10 Mhz AT cut quartz crystal is used as the piezoelectric component; and the oscillation frequency shift of the quartz crystal during the blood coagulation is monitored.
方法采用AT切向、基频10MHz的银膜石英晶体作为压电元件;