1.
Development of Lead Free Solder and Its Interfacial Issues in Electronics Packaging;
电子封装互连无铅钎料及其界面问题研究
2.
Study on Size Effect of Induction Heatng and Characteristics of Induction Heatng Interconnection Technology for BGA Packaging
电磁感应加热尺寸效应及其BGA封装互连新方法特征研究
3.
SIZE EFFECT OF MECHANICAL BEHAVIOR OF MINIATURE SOLDER JOINT INTERCONNECTIONS IN ELECTRONIC PACKAGING
电子封装微互连焊点力学行为的尺寸效应
4.
Microsystem Technology (Serials Four)──Packaging Technologies
微系统技术（连载四）──封装技术
5.
Research of Interactive Scene Simulation Platform Based on ActiveX/Vega Prime
基于ActiveX/VegaPrime的交互视景仿真平台封装的研究
6.
Function of Instrument Package Driver Technology Interchangeability
功能封装的仪器驱动程序可互换性实现技术
7.
Which of the following are data link layer encapsulation details?( Choose two.
(如下内容中的哪些是资料连结层封装细节?
8.
In response, the packet unit concatenates data words of an instruction sequence into contiguous blocks.
行为上，封装单元连接指令串中的资料成为一个连续的区块。
9.
One end of the cable is permanently connected to the enclosed mercury switch and the entire assembly is encapsulated to form a completely watertight and impact resistant unit.
电缆的一端永久性连接在封闭的水银开关内,这个完整的密封总装形成完全不透水、抗撞击装置。
10.
equipped with or connected by gears or having gears engaged.
装有齿轮、用齿轮连接或者齿轮相互啮合。
11.
Mechanical connection between towing vehicle and full trailers for interchangeability
GB/T4781-1984牵引车与全挂车的机械连接装置互换性
12.
Shear Strength of Flip Chip Packaging Bonded with Anisotropic Conductive Film
倒装芯片各向异性导电胶互连的剪切结合强度
13.
The Influence on PCBAs Interconnect Reliability with Lead–Free Processing
无铅化组装对印制板组件互连可靠性的影响
14.
Implementation Technique of Instrument Driver Interchangeability Based onFunctional Package
基于功能封装的仪器驱动程序可互换性实现技术研究
15.
Inspection of Miniaturised Interconnections in IC Packages with Nanofocus X-ray tubes and nanoCT
纳米焦点X射线管和纳米CT检测集成电路封装中的微型互联(英文)
16.
The circular male and female bonnet joint is self-aligning and encapsulates the gasket.
圆形外螺纹和内螺纹阀盖连接是自行对准调整并且封装的垫圈。
17.
A board, often ornately carved, attached along the projecting edge of a gable roof.
山墙封檐板常做装饰性雕刻的木板，与三角屋顶突出来的边相连
18.
Development of Middling Temperature Curing Isotropic Conductive Adhesive for Electronic Packaging Interconnection;
电子封装连接用中温固化型各向同性导电胶的开发