1.
hybrid microassembly
混合集成电路微组装
2.
Engineering Practice of Reliability Design and Prediction for a Card-Level Micropackaging Module
微组装插件可靠性设计和预测的工程实践
3.
microelectronic modular assembly
微电子学微型组件装置
4.
Temperature-triggered Assembly of Ta_2O_5 Hollow Microspheres
热诱导组装Ta_2O_5空心微球
5.
Patterning Macromolecules and Microcapsules by Soft Lithography;
软刻技术制备大分子微图案及微胶囊定向组装
6.
Synthesis and Fabrication of Inorganic/Polymer Core/Shell Microspheres
无机/聚合物核壳微球的合成与组装
7.
Study on Rare-Earth Doping and Self-organizing of Silica Colloidal Microspheres;
SiO_2胶体微球的稀土掺杂与自组装研究
8.
The Experiment Research on the Convective Heat Transfer of High-Density Assembly Microchannel;
高密度组装微通道对流换热实验研究
9.
The Simple Combined Microminiaturization Experiment Device of H_2S and SO_2;
简易的H_2S、SO_2组合微型化实验装置
10.
Discussion on the Practical Teaching of PC Installation and Maintenance
“微机组装与维修”实训教学模式的探讨
11.
Polymer-Assisted Micro-Scale Assembly of ZnO Nanosheets
微观尺度高分子协同组装ZnO纳米片
12.
Synthesis of micro/mesopous zeolites by degrading zeolite NaY as precursors and using CTMABr as a template
降解-CTMABr组装介-微孔分子筛的实验研究
13.
The Teaching Reforms of MicroComputer Assembly and Maintenance
《微机组装与维护》课程教学改革的探讨
14.
Microcomputer Installment Teaching Courseware Based on the Authorware
基于Authorware构建微机组装多媒体教学课件
15.
Assembly of mesoporous NiO microspheres based on sheet-like precursors
基于片状前驱体组装中孔NiO微球
16.
Fabrication of ordered microstructures based on self-assembled colloidal crystals
基于自组装胶体晶体构筑有序微结构
17.
The essential components of a microcomputerare often contained within single enclosure.
微型计算机的基本部件常组装在同一箱体中。
18.
Large Area Hybrid--An Advanced Microelectronic Packaging Concept
大面积混合电路——一种先进的微电子组装概念