1.
Mechanical Test Wafer- A silicon wafer used for testing purposes.
机械测试晶圆片-用于测试的晶圆片。
2.
Ingot- A cylindrical solid made of polycrystalline or single crystal silicon from which wafers are cut.
晶锭-由多晶或单晶形成的圆柱体，晶圆片由此切割而成。
3.
Process Test Wafer- A wafer that can be used for processes as well as area cleanliness.
加工测试晶圆片-用于区域清洁过程中的晶圆片。
4.
tours Powerchip Semiconductor Corporation's twelve-inch wafer plant in ....County.
赴…县参观力晶半导体十二吋晶圆厂
5.
Virgin Test Wafer- A wafer that has not been used in manufacturing or other processes.
原始测试晶圆片-还没有用于生产或其他流程中的晶圆片。
6.
Flat- A section of the perimeter of a wafer that has been removed for wafer orientation purposes.
平边-晶圆片圆周上的一个小平面，作为晶向定位的依据。
7.
Bonded Wafers- Two silicon wafers that have been bonded together by silicon dioxide, which acts as an insulating layer.
绑定晶圆片-两个晶圆片通过二氧化硅层结合到一起，作为绝缘层。
8.
Haze - A mass concentration of surface imperfections, often giving a hazy appearance to the wafer.
雾度-晶圆片表面大量的缺陷，常常表现为晶圆片表面呈雾状。
9.
Notch- An indent on the edge of a wafer used for orientation purposes.
凹槽-晶圆片边缘上用于晶向定位的小凹槽。
10.
Bonding Interface- The area where the bonding of two wafers occurs.
绑定面-两个晶圆片结合的接触区。
11.
Primary Orientation Flat- The longest flat found on the wafer.
主定位边-晶圆片上最长的定位边。
12.
Hot plate with silicon wafer lowered to heating position.
加热板与矽晶圆降低至加热位置。
13.
Slip- A defect pattern of small ridges found on the surface of the wafer.
划伤-晶圆片表面上的小皱造成的缺陷。
14.
Mound- A raised defect on the surface of a wafer measuring more than0.25 mm.
堆垛-晶圆片表面超过0.25毫米的缺陷。
15.
Pit- A non-removable imperfection found on the surface of a wafer.
深坑-一种晶圆片表面无法消除的缺陷。
16.
Waviness- Widely spaced imperfections on the surface of a wafer.
波纹-晶圆片表面经常出现的缺陷。
17.
Hot plate with silicon wafer in initial configuration (before heating).
加热板与矽晶圆在启始状态（加热前）。
18.
Smudge- A defect or contamination found on the wafer caused by fingerprints.
污迹-晶圆片上指纹造成的缺陷或污染。