1.
Theoretical Study of Molecular Device and Universal Device Model;
分子器件及通用分子器件模型（UDM）的理论研究
2.
The Simulation of the IGCT Model and Topology;
IGCT器件模型及拓扑结构仿真研究
3.
0.8μm SOI/CMOS SPICE Device Model Parameter Extraction;
0.8μm SOI/CMOS SPICE器件模型参数提取
4.
Study on Spice Modeling for Strained Si/SiGe MOSFET
基于Spice的应变Si/SiGe MOS器件模型研究
5.
A Model of SOI High Voltage Device with Reduced-field Layer and Partial Substrate
带降场层部分衬底SOI高压器件模型
6.
A model of high voltage SOI-LDMOS with trench oxide in drift region
漂移区槽氧高压SOI-LDMOS器件模型
7.
Comparison of three kinds of popular EDA software and methods of inputting devices spice model
三种电路仿真软件比较及器件模型加入方法
8.
The Realization of Intel82 Components in Multisim Software Platform Using VHDL;
INTEL82系列器件模型在MultiSIM软件平台中的VHDL语言实现
9.
Modeling and simulation of single-electron devices by asymmetric tunneling capacitance
非对称性隧穿电容单电子器件模型与模拟
10.
PSpice Model of the New Type Power Device N-MCT
新型功率器件N-MCT的PSpice模型
11.
Breakdown Model and New Structures of SOI Lateral High Voltage Devices;
SOI横向高压器件耐压模型和新器件结构研究
12.
SPICE Macro-Modeling of High-Voltage LDMOS Based on Chebyshev Theory;
基于Chebyshev理论的高压LDMOS器件SPICE宏模型
13.
Technology of Dynamic Simulation Model for Proteus
创建Proteus动态器件仿真模型的技术
14.
Research of connector model oriented component composition
基于连接器模型的构件组装技术研究
15.
Design and Implementation of Component Wrappers in the Heterogeneous Component Composition Model;
异构构件组装模型中构件包装器的设计与实现
16.
Study on Model and Conformability of SPC System Document for Electronic Components
电子元器件SPC体系文件模型及符合性探讨
17.
Numerical Simulation and Experimental Study on Heat Pipe Radiator for Electronic Element;
热管型电子器件散热器的数值模拟和实验研究
18.
These three primary models of ESD events are Human Body Model (HBM), Machine Model (MM), and Charged Device Model (CDM).
这三种基本静电模型是:人体放电模型、带电器件放电模型、机器放电模型。