1.
Finite Element Simulation of the Thermal Stresses in Y_2O_3 Thin Films
Y_2O_3薄膜热应力分布的有限元模拟
2.
Temperature and Thermal Stress Distribution in Single Lap Joint
单搭接接头温度场与热应力分布的研究
3.
Thermal Stress Distribution of GaAs and InP Crystals in LEC Growth and of GaAs Crystal in LEFZ Growth;
LEC法生长GaAs、InP晶体及LEFZ法生长GaAs晶体中热应力分布
4.
Study of Thermal Stress Distribution on Thick Wall Cylinder by Thermal Shock Treatment;
厚壁圆筒热冲击作用下应力分布研究
5.
Research on Residual Stress Distribution of High Strength Hot-rolled Plate before and after Straightening
热轧高强度钢板矫直前后残余应力分布的研究
6.
Influence of Initial Temperature Distribution on Residual Stresses of Hot-leveled TMCP Plate
热矫初始温度分布对TMCP钢板残余应力的影响
7.
THE GENERALIZED ENERGY-EFFICIENCY DISTRIBUTION MATRIX EQUATION AND ITS APPLICATION
热力系统广义能效分布矩阵方程及其应用
8.
Large food items should be left inside the oven for an additional10-20 minutes after cooking to ensure even distribution of heat.
大件食物于烹煮后，应放置炉内10至20分钟，让热力均匀散布。
9.
The Study of the Thermal Effect of the Active Medium in Solid State Heat Capacity Laser(SSHCL)
固体热容激光器增益介质的温度和应力分布研究
10.
EXPERIMENTAL RESEARCH ON THE THERMAL RESIDUAL STRESS DISTRIBUTION OF POLYCRYSTALLINE DIAMOND COMPACTS
聚晶金刚石复合片热残余应力分布规律实验研究
11.
Thermal Analysis and Optimal Design of a Distributed Energy System;
分布式能源系统的热力学分析与优化
12.
THE THERMAL EFFECT OF MERIDIONAL SEA-LAND DISTRIBUTION ON THE GENERAL ATMOSPHERIC CIRCULATION IN EURASIA AND ITS CONTIGUOUS AREAS
经向海陆分布对大气环流的热力作用
13.
The thermodynamic properties of two-dimensional Bose gas in the q distribution
q分布下二维玻色气体的热力学性质
14.
Thermodynamics model and experimen talvalidating on thermal field distribution of traditional moxibustion
传统灸法热场分布的热力学模型及实验验证
15.
Improving Heating Capacity of Heat-supply Network by Distributed Variable-frequency Pump System
利用分布式变频泵系统提高热网的供热能力
16.
The Study of Thermal Effects in Diode Pumped Solid-State Laser;
端泵DPL中热效应的空间分布研究
17.
Spatial Analysis of Land Surface Temperature and Fluxes in Urban Heat Island over Xi'an City
城市热岛效应地表通量空间分布研究
18.
Analysis and Comparison of Thermal Stress and Hygrothermal Stress of Lead-free Flip Chip Solder Joint
无铅倒装焊点的热应力与湿热应力分析