1.
Research on Encapsulation Technique of FBG Strain Sensor Under High Strain Working Condition
高应力状态下FBG应变传感器的封装研究
2.
Research on the Package of Humidity Sensor Compatible with CMOS Technology;
CMOS兼容湿度传感器封装的研究
3.
Thick Film Integration Package Technology for Pressure Sensor
压力传感器的厚膜混合集成封装技术
4.
Direct Chip Attachment Packaging of a 2-D Thermal Flow Sensor
采用芯片直接安装技术封装的风速风向传感器
5.
safe sensor with seal for wire end
接线端具有封印保护装置的安全传感器
6.
Research of Demodulation and Packaging Tecknics on Fiber Grating Sensors;
光纤光栅传感器解调技术及封装工艺的研究
7.
Study on System-in-Package Technology of MEMS Air Pressure Sensor;
MEMS气体压力传感器的系统级封装（SiP）技术研究
8.
Design of High-pressure Packing Seal for Pressure Sensor Calibration Device
压力传感器标定装置高压密封垫的设计
9.
Fiber Bragg Grating Temperature Sensor without the External Stress Encapsulation
无外应力封装的光纤Bragg光栅温度传感器
10.
Study on CFRP Encapsulating Fiber Bragg Grating Sensor;
碳纤维复合材料封装FBG传感器研究
11.
Packing Technology of High Temperature Pressure Transducer
MEMS耐高温压力传感器封装工艺
12.
Integration and Packaging of Sensors and MEMS Devices Through Low Temperature Wafer Bonding
用低温圆片键合实现传感器和微电子机械系统器件的集成和封装
13.
Structural Analysis and Tests of Encapsulation Shell of Fiber Bragg Grating Hydraulic Seepage Sensor
光纤光栅水工渗压传感器封装的结构分析与试验
14.
Process Mechanics Modeling of Pressure Sensor Packaging and High-Brightness LED Packaging;
微压力传感器和白光LED封装的工艺力学数值模拟
15.
Influences of the Packaging Structure of Platinum Resistance Temperature Sensor on Response Time
铂电阻温度传感器封装结构影响响应时间的因素
16.
Study of Inertial Step Response of a Novel MEMS Capacitive Accelerometer with Variable Areas in Low Vacuum
低真空封装的新型变电容面积MEMS惯性传感器阶跃响应特性分析
17.
The Fiber Bragg Grating and the Sensing Study on the Sensor Encapsulated by the Alloyed Steel;
光纤Bragg光栅及其合金钢封装传感器特性研究
18.
Enhancing-sensitivity packaging technique and experimental study for fiber Bragg grating temperature sensor
FBG温度传感器增敏封装技术及实验研究