1.
Research on the Technology of High Efficiency Lapping Method of Hard Material Sphere;
硬质材料精密球的高效研磨技术研究
2.
Research of Polishing Technology for InSb Semiconductor Materials
InSb半导体材料抛光研磨技术研究
3.
State-of-the-Art of the Precision Ball Lapping Technique
精密球体研磨技术的现状与发展方向
4.
Study on coating technology of wear and corrosion resistance for hydraulic turbine
水轮机用耐磨蚀磨损涂层技术的研究
5.
Studies on Theory and Key Techniques of Tangential Point Tracing Grinding;
切点跟踪磨削法磨削理论及若干关键技术研究
6.
Study of Micrology Shape Analysis and Automatic Identification Technique for Wear Particles;
磨损磨粒的显微形态分析与自动识别技术研究
7.
Research on Grinding Hardening of Middle Carbon Steel by Grinding Strengthen Technology
磨削强化技术对中碳钢磨削淬硬效果的研究
8.
Research on Technology of Filtration s Application on High Efficiency Comminution by Tumbling Mill;
磨内筛分技术在管磨机高细高产粉磨中的应用研究
9.
Application of Micro-stage Grinding Technique in Copper Mine
微阶段磨矿技术在铜矿山的应用研究
10.
Research on the Key Technique on Noncircular Crankshaft Grinding;
曲轴非圆磨削轨迹控制关键技术研究
11.
The Technology of Abrasive Cluster with Controlled Distribution and Development of Its Grinding Wheel;
磨料群可控排布技术及其砂轮的研制
12.
Grinding Technology & Mechanism Research on Underwater Diamond Wire Saw;
水下金刚石绳锯磨削技术及机理研究
13.
Study of CAE Technology on the Rotator of Large-scale Semi-autogenous Grinding;
大型半自磨机回转体CAE技术研究
14.
Study of Application of CAE Technique on Hydrostatic Journal Bearings of the Large-scale Ball-grinding Mill;
大型球磨机静压轴承CAE技术应用研究
15.
Development of Pulse Power and Experimental Research of ELID Grinding Technology;
脉冲电源改进及ELID磨削技术实验研究
16.
Research on the Narrow Slot Grinding Technology of SiCp/Al Composites;
铝复合材料SiCp/Al窄槽磨削技术研究
17.
An Investigation of Technologies for Grinding Natural Diamond Tools Cutting Edge and Equipments;
天然金刚石刀具刃磨技术及设备研究
18.
Research the Key Technology of Silicon Wafer's Grinding Device Based on Silicon Wafer Rotating;
硅片自旋磨削试验台关键技术的研究