1.
Important Technique Problems in Silk Screen Printing for Thick Film Integrated Circuits
厚膜集成电路网印应注意的技术问题
2.
Alumina ceramic substrates for thick film integrated circuits
GB/T14619-1993厚膜集成电路用氧化铝陶瓷基片
3.
circuit, integrated hybrid, thin or thick film
混合集成电路,薄膜或厚膜的
4.
The Reliability-Analysis for HIC and Its Improvement;
厚膜混合集成电路可靠性分析与提高
5.
Application of Virtual Instruments Technique in HIC Testing;
虚拟仪器技术在厚膜混合集成电路测试中应用
6.
The Application of Infrared Imaging Technology on The Thermal Design of Thick Film Hybrid IC
热成像技术在厚膜混合集成电路热设计中的应用
7.
circuit, thin or thick film, consisting solely of passive elements
薄膜或厚膜电路,仅由无源元件组成
8.
Applied dedicated thick diaphragm and high-power integrated circuit to have high precision on voltage stability and constant current output.
采用专用的厚膜大功率集成电路,具高精度的稳压及恒流输出特牲。
9.
Development of 64-route Thick Film Hybrid Integrated Switching Module;
64路厚膜混合集成开关模块的研制
10.
passive hybrid film integrated circuit
无源混合膜集成电路
11.
film mounted ic
膜载组装的集成电路
12.
Generic specification for film integrated circuits and hybrid film integrated circuits
GB/T8976-1996膜集成电路和混合膜集成电路总规范
13.
Case outlines for film integrated circuits and hybrid integrated circuits
GB/T15138-1994膜集成电路和混合集成电路外形尺寸
14.
Thick-film hybrid integrated capacitive accelerometer
基于厚膜混合集成的电容式加速度传感器
15.
graphic-art technique
图形法-厚膜电路工艺用
16.
Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of the qualification approval procedure
GB/T13062-1991膜集成电路和混合膜集成电路空白详细规范(可供认证用)
17.
Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of the capability approval procedures
GB/T16465-1996膜集成电路和混合膜集成电路分规范（采用能力批准程序）
18.
Circuit Design of Discrete Element Replacing Integrated Circuit Chip of Thickness Sensor of Carding Machine Imported
替代进口梳棉机测厚传感器集成电路芯片分立元件的电路设计