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1.
Effect of Pb on Propert of Sn-9Zn Alloy Solder
微量铅对Sn-9Zn合金钎料性能的影响
2.
A Study of Sn-9Zn Lead-free Electronic Solder and Its Improvement by Alloying;
Sn-9Zn无铅电子焊料及其合金化改性研究
3.
A Study of the Creep Property of Sn-9Zn Solder and Its Strengthen;
Sn-9Zn钎料蠕变性能及其复合增强研究
4.
Effects of Ga,Al and Ag multi-additions on wetting properties of Sn-9Zn lead-free solders
复合添加Ga,Al,Ag对Sn-9Zn钎料性能的影响
5.
Development of New Flux Used for Sn-9Zn Lead Free Solder;
Sn-9Zn无铅钎料助焊剂的研究
6.
A Study of New Flux for Sn-9Zn Lead-free Electronic Solders;
Sn-9Zn无铅电子钎料新型助焊剂研究
7.
Effect of Cu addition on Sn-9Zn lead-free solder properties
添加铜对Sn-9Zn无铅钎料性能的影响
8.
Aging Characteristics of Pd-Ag-Sn-In-Zn Alloy
Pd-Ag-Sn-In-Zn合金时效特性
9.
Effects of trace RE and Al on microstructure and properties of lead-free solder alloy of Sn-9Zn
微量RE和Al对Sn-9Zn焊料组织与性能的影响
10.
Wettability of Sn-9Zn-xAg lead-free solder and mechanical properties of soldered joints
Sn-9Zn-xAg无铅钎料润湿性能及焊点力学性能
11.
Influence of Aging Treatment on Microstructure and Shear Property of Sn-9Zn/Cu Brazed Joint
时效处理对Sn-9Zn/Cu界面组织及剪切性能的影响
12.
Wettability of Sn-Zn,Sn-Ag-Cu and Sn-Bi-Cu Lead-free Solder Alloys with Copper Substrate
Sn-Zn,Sn-Ag-Cu和Sn-Bi-Cu无铅焊锡合金与铜的润湿性
13.
Effect of Sn on the Microstructure and Properties of Ti-Zr-Nb-Sn Alloy System;
Sn元素对Ti-Zr-Nb-Sn合金系组织和性能的影响
14.
Effects of Sn content on the anticorrosion property of Ni-Sn-P alloy plating
Sn含量对Ni-Sn-P合金镀层耐腐蚀性能的影响
15.
Effect of Sn content on microstructure and phase structure of TiNbSn alloy
Sn含量对Ti-Nb-Sn合金组织及相结构的影响
16.
Study on Electroplating Ni-Sn-P Alloy Coating and Composite Coating
电镀Ni-Sn-P合金及其复合镀层的研究
17.
A Study on Hypoeutectic Sn-Zn Alloys as Lead-free Solders;
亚共晶Sn-Zn合金无铅电子焊料研究
18.
Aluminum Alloy Soldering Procedure Research Based on the Sn-Pb-Zn Solder;
基于Sn-Pb-Zn钎料铝合金钎焊工艺研究