1.
Effect of Sn on the Microstructure and Properties of Ti-Zr-Nb-Sn Alloy System;
Sn元素对Ti-Zr-Nb-Sn合金系组织和性能的影响
2.
Effects of Alloying Elements on Performance of Sn-Zn Solder
合金化元素对Sn-Zn钎料性能的影响
3.
Effect of Ge on Interfacial Reaction Sn-3.5Ag Alloy/Cu Interface
锗元素对Sn-3.5Ag合金/铜界面反应的影响
4.
Effect of Alloy Element Addtion on IMC at the Soldering Interface of Sn-based Binary Solders;
合金元素对二元Sn基钎料钎焊界面IMC的影响
5.
Effect of Alloying Element Zn, Sn, In on Microstructure and Properties of 925Ag;
合金元素Zn、Sn、In对925银组织和性能的影响
6.
The Influences of Minor Elements on Sn-0.7Cu Lead-free Solder
微量添加元素对Sn-0.7Cu无铅钎料性能的影响
7.
Effect of the Indentation Creep Property of Sn-0.7Cu Lead-free Solder Containing Alloy Elements
合金元素对Sn-0.7Cu无铅钎料压入蠕变性能的影响
8.
Current situation on Sn-Zn lead-free solders affected with micro alloying elements
微量元素对Sn-Zn系钎料性能和组织的影响
9.
Research progress of Sn-0.7Cu system lead-free solder modified by microelements
微量元素改性Sn-0.7Cu系无铅钎料的研究进展
10.
The Study of Sn-Ag and Sn-Zn Multi-Composition System Lead-Free Solder Alloys;
Sn-Ag和Sn-Zn系多组元无铅软钎料研究
11.
Influence of Tramp Elements Arsenic, Tin and Antimony Segregation to Grain Boundary on Hot Ductility of CC Steels;
残留元素As、Sn、Sb的晶界偏聚对连铸钢热塑性的影响
12.
The Effect of Processing Property and Interface Behavior in the Joints of the Sn-based Lead Free Solder with Additional Elements;
添加元素对Sn基无铅钎料工艺性能及接头区界面行为的影响
13.
Effect of Alloying Elements and Aging on Microstructure and Solder Interface of Sn-Zn Lead-free Solders
合金元素及时效处理对Sn-Zn无铅钎料组织和钎焊界面的影响
14.
Effect of Grain Boundary Segregation of Residual Elements Cu-As-Sn on Intergranular Embrittlement Fracture of Low Alloying Steel
低合金钢残余元素Cu-As-Sn的晶界偏析对晶间脆性断裂的影响
15.
The Study of Influence Ag-Sn Powder Metal Internal Oxidation With Different Additive Element
添加元素对Ag-Sn系合金粉末氧化性能的影响研究
16.
Effect of Ag and Ni on melting temperature and spreadability of Sn-SbCu solder alloy
Ag和Ni元素对Sn-Sb-Cu无铅钎料熔化温度和铺展性能的影响
17.
The Study on Mixture Design of Multiplex Sn-Zn System Lead-free Solder;
多元Sn-Zn系无铅钎料混料设计的研究
18.
Study on the Process of Cu-Sn-Zn Cyanide-free Gold Imitation Plating
Cu-Sn-Zn三元无氰仿金电镀工艺研究