1.
Study on Compressive Creep Properties of the Sn-Zn Lead-free Solder;
Sn-Zn无铅钎料压蠕变行为的研究
2.
Effect of Alloying Elements and Aging on Microstructure and Solder Interface of Sn-Zn Lead-free Solders
合金元素及时效处理对Sn-Zn无铅钎料组织和钎焊界面的影响
3.
The Study of Sn-Ag and Sn-Zn Multi-Composition System Lead-Free Solder Alloys;
Sn-Ag和Sn-Zn系多组元无铅软钎料研究
4.
The Study on Mixture Design of Multiplex Sn-Zn System Lead-free Solder;
多元Sn-Zn系无铅钎料混料设计的研究
5.
Investigation on Low Temperature Sn-Zn Base Lead-Free Solder Alloys
低熔点Sn-Zn系无铅钎料的研究
6.
Investigation on fluxes for Sn-Zn-Al lead-free solder
Sn-Zn-Al无铅钎料的助焊剂研究
7.
Research on the Properties and the Interfacial Reactions of Sn-Zn-Cu(Ni) Lead-free Solders;
Sn-Zn-Cu（Ni）无铅钎料及其钎焊接头界面反应研究
8.
Effects of different fluxes on the characteristics of Sn-Zn solders
不同钎剂对Sn-Zn系无铅钎料润湿特性的影响
9.
The Research on Oxidation Resistance and Wettability of Sn-Zn System Lead-free Solder;
Sn-Zn系无铅钎料抗氧化性与润湿性研究
10.
Microstructure and properties of Sn-Zn-Bi-(P,Nd) lead-free solders
Sn-Zn-Bi-(P,Nd)无铅钎料的微观组织及性能
11.
Research on Compressive Creep Bechavior of the Sn-Cu Lead-free Solder;
Sn-Cu无铅钎料压蠕变性能的研究
12.
Development of New Flux Used for Sn-9Zn Lead Free Solder;
Sn-9Zn无铅钎料助焊剂的研究
13.
A Study of New Flux for Sn-9Zn Lead-free Electronic Solders;
Sn-9Zn无铅电子钎料新型助焊剂研究
14.
The Development and Study of Low Ag Sn-0.3Ag-0.7Cu-XBi Lead-free Solder;
Sn-0.3Ag-0.7Cu-XBi低银无铅钎料的开发与研究
15.
The Study of the Effect of Sb on Sn-0.7Cu Lead-free Solder;
Sb对Sn-0.7Cu无铅钎料性能影响的研究
16.
Wettability test of Sn-0.7Cu-xAg-yBi lead-free solder
Sn-0.7Cu-xAg-yBi无铅钎料润湿性试验
17.
Effect of Cu addition on Sn-9Zn lead-free solder properties
添加铜对Sn-9Zn无铅钎料性能的影响
18.
Regression analysis for Sn-Ag-Bi-Cu lead-free solder conductive properties
Sn-Ag-Bi-Cu无铅钎料导电性能回归分析