1.
Microstructure investigation for the interface of electric resistance welded Cu/Al thin walled tube
薄壁铜铝管电阻焊焊接界面的微观结构研究
2.
Nanocrystalline structure at explosive weld interface of 321 and Qd370qD steels
321钢/Qd370qD钢爆炸焊接界面纳米晶组织
3.
Microstructure of cementite beside interface in 321/Qd370qD explosive welding
321/Qd370qD爆炸焊接界面渗碳体的微观结构
4.
Microstructural Features Beside Interface in 321/Qd370qD Explosive Welded Plate
321/Qd370qD爆炸焊接界面渗碳体特征
5.
Influence of Phosphorus on Reliability of Interface between Au/Ni/Cu Pad and SnAgCu Solder Joint
P对Au/Ni/Cu焊盘与SnAgCu焊点焊接界面可靠性的影响
6.
EFFECT OF MATERIAL STRENGTH ON FORMING PROCESS OF EXPLOSIVE WELDING INTERFACE WAVE
材料强度在爆炸焊接界面波形成过程中的作用
7.
Interface behavior of TLP between chromium-copper alloy and stainless steel
铬青铜与不锈钢瞬间液相扩散焊接界面行为
8.
Experimental Study on the Deformation and Damage of Composite Adhesively Bonded Joints and Bimetal Solder Film
复合材料胶接及异材焊接界面形变与断裂的实验研究
9.
Effect of interface morphology on mechanical property of FSW lap joints on 2024-T3 Al-alloy thin plank
2024-T3薄板搅拌摩擦焊搭接界面成型及接头性能
10.
Research on the Properties and the Interfacial Reactions of Sn-Zn-Cu(Ni) Lead-free Solders;
Sn-Zn-Cu（Ni）无铅钎料及其钎焊接头界面反应研究
11.
The Microstructure and Forming Mechanism of Brazing Interface of TiAl Alloy to Steel 42CrMo;
TiAl合金与42CrMo钢钎焊连接界面组织及形成机理
12.
Interface structure and strength analysis of brazed GH3044 nickel-based alloy joint
GH3044镍基合金钎焊接头的界面组织和强度分析
13.
Interface structuce of ceramic/AgCuTi/stainless steel brazed joint
陶瓷/AgCuTi/不锈钢钎焊连接界面组织与结构
14.
The Research of Single Face Welding-Double Face Forming Automatic Welding Equipment;
单面焊双面成形自动焊接设备的研制
15.
Transient Contact Liquid-Solid Reaction of Solder Droplet/Pad and Interfacial Microstructure Evolution;
钎料熔滴/焊盘瞬间接触液固反应及界面组织演变
16.
Diffuse Interface Field Variable Models Simulation of Grain Growth in Welding Heat Affected Zones;
焊接热影响区晶粒长大的扩散界面场变量模型模拟
17.
Effect of Explosive Welding Parameter on Composite Plates Interface Structure and Mechanical Properties;
爆炸焊接参数对复合板界面组织及力学性能的影响
18.
Effect of the Addition of Al or in on the Microstructural Formation of Sn-Ag-Zn Solder and the Exploration of the Soldered Interface;
Al、In对Sn-Ag-Zn焊料组织形成的影响及连接界面的研究