1.
INTERFACIAL STRUCTURE AND MECHANICAL PROPERTIES OF ALUMINIUM FOAM JOINTS FLUXLESS-SOLDERED WITH Zn-Al-Cu BASE ALLOY
Zn-Al-Cu基合金无钎剂钎焊泡沫铝的界面结构及力学性能
2.
Effects of different fluxes on the characteristics of Sn-Zn solders
不同钎剂对Sn-Zn系无铅钎料润湿特性的影响
3.
Development of New Flux Used for Sn-9Zn Lead Free Solder;
Sn-9Zn无铅钎料助焊剂的研究
4.
A Study of New Flux for Sn-9Zn Lead-free Electronic Solders;
Sn-9Zn无铅电子钎料新型助焊剂研究
5.
Investigation on fluxes for Sn-Zn-Al lead-free solder
Sn-Zn-Al无铅钎料的助焊剂研究
6.
Experimental study on an organic-metal soldering flux with lead-free and low temperature for aluminum soldering
有机金属型铝用无铅低温软钎剂的试验
7.
Study on the new type soldering acid and filler metal for restoration of ancient bronze;
古代青铜器修复钎焊用钎剂与钎料的改性研究
8.
Research on the New Lead-Free Solder Processing Properties of Brazing and Mechanical Properties;
新型无铅钎料钎焊工艺性及机械性能的研究
9.
Research on the Properties and the Interfacial Reactions of Sn-Zn-Cu(Ni) Lead-free Solders;
Sn-Zn-Cu（Ni）无铅钎料及其钎焊接头界面反应研究
10.
Study on Mechanical Property and Solder ability of SnAgCu System Lead-free Solder Alloy
SnAgCu系无铅钎料合金力学性能及钎焊性能研究
11.
Duality of Influence of Flux on Brazing Property Between Aluminum Alloys and Stainless Steel in Air
钎剂对铝合金与不锈钢大气钎焊性影响的二重性
12.
This paper introduces the connection using the brazing technique, selects corresponding brazing filler metal and flux together with proper technology, and determines the techniques and measures.
介绍了采用钎焊的方法进行连接;选择了相应的钎料与钎剂;并确定了工艺及措施。
13.
Research on the Liquid Structure of Lead-free Solders and the Interfacial Reaction during Soldering and Their Correlation;
无铅钎料的液态结构与钎焊界面反应及其相关性研究
14.
Microstructure and Performance of Sn-9Zn Based Lead Free Solder/Cu Solder Joint and Their Interface Region
Sn-9Zn基无铅钎料/Cu钎焊接头及界面区组织性能的研究
15.
Effect of Alloying Elements and Aging on Microstructure and Solder Interface of Sn-Zn Lead-free Solders
合金元素及时效处理对Sn-Zn无铅钎料组织和钎焊界面的影响
16.
Microstructure and Solderability of Sn-Ag-Cu Lead-free Solder Powder and Alloy
Sn-Ag-Cu无铅钎料粉末与合金的组织及钎焊性能对比
17.
Thermomechanical Fatigue Properties of Lead-Free Solder Joints;
无铅合金钎焊接头热疲劳性能的研究
18.
Research on Compressive Creep Bechavior of the Sn-Cu Lead-free Solder;
Sn-Cu无铅钎料压蠕变性能的研究