1.
Investigation on Solidification Cracking Susceptibility of 690 Nickel-based Welding Strip Surfacing Metal;
690镍基合金焊带熔敷金属结晶裂纹敏感性研究
2.
Effects of Ni/P/Ce on oxidation resistance and solidification crack of SnAgCu lead free solder alloy
Ni/P/Ce对SnAgCu抗氧化性能和结晶裂纹的影响
3.
The splitting or tendency to split of a crystallized substance along definite crystalline planes, yielding smooth surfaces.
解理，裂纹结晶物质沿一定结晶面产生光滑面的分裂或分裂倾向
4.
Great rents and splits branched out in the solid walls, like crystallisation;
坚实的墙壁以结晶的纹样作树枝形迸裂，迸出了巨大的豁口和裂缝。
5.
The results show that the fracture surface is characterized by a combination of most intergranular brittle regions and a few cleavage regions, and there are finer precipitations on grainboundaries.
结果表明，成型模裂纹断口形态呈沿晶特征，沿晶面上有细小析出物，为脆性断裂。
6.
Effect of Continuous Casting Mold Oscillation Parameters on Slab Surface Cracks Formation Under High Casting Speed
高拉速连铸结晶器振动参数对板坯表面裂纹形成的影响
7.
Causes and Countermeasures for Mould Copper Plate Cracking in High Speed Caster
高拉速连铸机结晶器铜板裂纹原因分析及预防措施
8.
Research on Fracture and Crack Arrest in Ship Structures
裂纹损伤舰船结构的断裂及止裂研究
9.
A flaw in the crystal that caused it to shatter.
水晶上的一处裂纹导致了它的破碎
10.
Mechanism of Crack Formation During Continuous Casting of Peritectic Steel Slabs
包晶钢铸坯裂纹形成机理的实验研究
11.
Effect of abnormally large prior-austenite grains on the presence of surface intergranular cracks
异常粗大的奥氏体晶粒对表面晶间裂纹的影响
12.
The morphology of crack propagation indicate that there is the toughening mechanism of whisker's pull- out and crack deflection.
裂纹进展形态表明,存在晶须拔出及裂纹偏转增韧机制。
13.
Crack- A mark found on a wafer that is greater than0.25 mm in length.
裂纹-长度大于0.25毫米的晶圆片表面微痕。
14.
Grain size had some effect on the rate of crack propagation.
晶粒尺寸大小对裂纹扩展速率也有影响。
15.
Study on Partial Cone Cracks in Nano-grinding of Single Crystal Silicon;
单晶硅纳米磨削过程的摩擦裂纹试验研究
16.
Investigation the Relationship Between Welding Hot Crack and Grain Size;
焊接热裂纹与母材晶粒粗大的关系讨论
17.
Thermal Fatigue Behavior of Single-Crystal Superalloy
单晶高温合金的冷热疲劳裂纹生长行为研究
18.
The fine grains, crack deflexion and grain-bridging are main toughening mechanisms of silicon carbide ceramic.
细晶、裂纹偏转和晶粒桥联是碳化硅陶瓷的主要增韧机制。