1.
Research of PBGA Voids in Lead-Free Reflow Process
无铅再流焊接PBGA空洞缺陷研究
2.
Simulation for Lead-free Solder in the Reflow Welding of PCB Warpage Deformation;
无铅钎料在PCB再流焊中翘曲的模拟仿真
3.
Effect of Cooling Rate on Quality of Solder Joints in Lead-Free Reflow Soldering;
无铅回流焊冷却速率对焊点质量的影响
4.
The most obvious is the necessity for increased reflow temperature.
最明显的是，使用无铅锡膏必须提高回流焊温度。
5.
Study of the Reliability of Power Device with Lead-free Heat-sink Attachment;
功率器件无铅焊料焊接层可靠性研究
6.
Properties of Sn-3.0Ag-0.5Cu-xNi lead-free solders and soldering joints
Sn-3.0Ag-0.5Cu-xNi无铅焊料及焊点的性能
7.
Pb-free solders– Sn-Bi-Zn based with our own patent and their modification to fit for package applications.
无铅焊锡—锡铋锌系无铅焊锡，材料设计、发，焊料（球、膏）发等。
8.
Pb-free solders ? Sn-Bi-Zn based with our own patent and their modification to fit for package applications.
无铅焊锡—锡铋锌系无铅焊锡，材料设计、开发，焊料（锡球、锡膏）开发等。
9.
Excellent in solderability and high heat resistance with either flow or reflow soklering.
可焊性和耐焊性优，适用于流焊和再流焊。
10.
The Research of Sn-Zn System without Ag Lead-free Solder
新型Sn-Cu系无银无铅焊料的研究
11.
Investigation on Fabrication of a Low Melting Point Lead-free Sn-Bi-X Solders and Lead-free Soldering Process;
低熔点无铅焊料Sn-Bi-X的研制与无铅焊接工艺研究
12.
Application and Development of Surface Mount Technology;
从有铅向无铅焊接过渡阶段应注意的问题
13.
SnAgCuBi-Solder Alloy Development and Its Joint Interfacial Behavior Study;
SnAgCuBi系无铅焊料的开发及其焊点界面行为的研究
14.
Study of Organic Activated Flux for Sn-9Zn Lead-free Solder;
Sn-Zn无铅电子焊料有机活化助焊剂研究
15.
Impact of Lead-Free Solder on the Result of Soldering Resistance Test
采用无铅焊料对测覆铜板耐浸焊结果的影响
16.
A: IPC is currently working to revise the specification for inspection of lead-free solder joints.
IPC正在修订关于无铅焊接的质检标准。
17.
A Study on Hypoeutectic Sn-Zn Alloys as Lead-free Solders;
亚共晶Sn-Zn合金无铅电子焊料研究
18.
Thermomechanical Fatigue Properties of Lead-Free Solder Joints;
无铅合金钎焊接头热疲劳性能的研究