1.
ECMP of Cu in the Preparation Process of ULSI
ULSI制造中Cu的电化学机械抛光
2.
Study on Electrochemical Mechanism and Polishing Rate of Chemical-Mechanical Polishing of Copper;
铜化学-机械抛光电化学机理与抛光速率的研究
3.
A Test Study On Electrochemical Mechanical Finishing D60 Tungsten Steel
D60钨钢电化学机械复合抛光试验研究
4.
Electroplate and chemical mechanical polishing technology of ULSI
VLSI的电镀和化学机械抛光技术
5.
Study on Conditioner for Polishing Pad in CMP;
化学机械抛光用抛光垫修整器的研究
6.
Study on Electrochemistry and Polishing Rate of Chemical Mechanical Polishing of Semiconductor Silicon Wafer;
半导体硅片化学机械抛光电化学与抛光速率研究
7.
Study on Chemical Mechanical Polishing of Tantalum Lithium Crystal Wafer;
光电子材料钽酸锂晶片化学机械抛光过程研究
8.
Study on and Fabrication of Chemical Mechanical Polishing Tester with Electrochemical Testing System;
化学机械抛光电化学测试试验台的研制
9.
Application of chemical mechanical polishing on the finish machining
化学机械抛光技术及其在电子制造中的应用
10.
Study on Conditioning Technology of Polishing Pad in CMP;
化学机械抛光中抛光垫修整技术的研究
11.
Chemical mechanical polishing for silicon wafer by composite abrasive slurry
利用复合磨粒抛光液的硅片化学机械抛光
12.
Study on CMP Slurry of CVD Diamond Film;
CVD金刚石膜化学机械抛光液的研制
13.
Material removal characteristic of silicon wafers in chemical mechanical polishing
单晶硅片化学机械抛光材料去除特性
14.
The Study of the CMP Technology of SiO_2 ILD in ULSI;
超大规模集成电路二氧化硅介质层的化学机械抛光技术的研究
15.
Research for Aluminum Interconnected Line and Aluminum Plug Chemical Mechanical Polishing in ULSI;
甚大规模集成电路中铝布线及铝插塞化学机械抛光的研究
16.
A Study on the CMP of Coper for Mulilevel Metallization in ULSI;
甚大规模集成电路铜布线工艺中化学机械抛光技术的研究
17.
Influence of abrasive and chemical composition on chemo-mechanical polishing of MgO single crystal substrate
抛光液中磨料和化学成分对单晶MgO基片化学机械抛光的影响
18.
Study on Pad Properties & Effects on Processing in CMP;
抛光垫特性及其对化学机械抛光效果影响的研究