1.
Bumping Technology for MEMS Flip Chip Packaging;
MEMS封装中的倒装芯片凸点技术
2.
Investigation of the Glass-ceramics Used for Anodic Bonding Material in MEMS;
MEMS封装用静电键合微晶玻璃的研究
3.
Research on MEMS Packaging by Induction Heating and Its Applications;
基于感应加热的MEMS封装技术与应用研究
4.
Research on Some Basic Issues of MEMS Packaging Based on Process Mechanics;
基于工艺力学的MEMS封装若干基础问题研究
5.
Influence Factors Research and Design Factors Analysis on Anode linkage Technology in MEMS Packaging
MEMS封装中阳极键合技术的影响因素研究和设计因素分析
6.
Research on RF MEMS Switch Packaging;
RF MEMS开关封装技术的研究
7.
Packing Technology of High Temperature Pressure Transducer
MEMS耐高温压力传感器封装工艺
8.
Device level vacuum packaging technologies of MEMS gyroscopes
MEMS陀螺仪器件级真空封装技术
9.
Study on System-in-Package Technology of MEMS Air Pressure Sensor;
MEMS气体压力传感器的系统级封装（SiP）技术研究
10.
Study on the Application of Wafer-level Hermetic Package of MEMS by Glass Frit at Low Temperature;
低温玻璃浆料在MEMS气密封装中的应用研究
11.
Study on the Application of Bonding Technology for Cu/Sn Isothermal Solidification in MEMS Hermetic Package;
Cu/Sn等温凝固键合在MEMS气密封装中的应用研究
12.
Mechanism and Process of Cu-Sn Bonding for Wafer Level MEMS Packaging
MEMS圆片级封装用Cu-Sn低温键合机理与工艺研究
13.
Study on Low Temperature Glass Frit Bonding for MEMS Device
MEMS器件封装的低温玻璃浆料键合工艺研究
14.
Flexible Bumping Technology and Applications in MEMS Flip Chip Packaging;
MEMS器件倒装芯片封装中的柔性化凸点制备技术及其应用
15.
Design of MEMS Chip-Scale Atomic Clock and Hermetic Packaging of Cs/Rb Vapor;
MEMS原子钟理论、设计及Cs/Rb气体盒气密性封装研究
16.
Cu/Sn Isothermal Solidification Technology for Wafer-level Hermetic Packaging of MEMS;
Cu/Sn等温凝固键合技术在MEMS圆片级气密封装中的应用
17.
Study of Inertial Step Response of a Novel MEMS Capacitive Accelerometer with Variable Areas in Low Vacuum
低真空封装的新型变电容面积MEMS惯性传感器阶跃响应特性分析
18.
Research of Equipment of Measuring Mechanical Properties of MEMS Materials
MEMS材料力学性能测试装置研究