1.
Reliability analysis of PBGA devices with different finishes under hygrothermal environment in lead-free electronics package
无铅封装中镀覆层对PBGA耐湿热可靠性的影响
2.
Interfacial Reaction and Reliability in Lead-free Electronics Packaging;
无铅电子封装中的界面反应及焊点可靠性
3.
Development of Lead Free Solder and Its Interfacial Issues in Electronics Packaging;
电子封装互连无铅钎料及其界面问题研究
4.
Interfacial Evolution and Reliability of Lead-Free Solder Joints for Electronic Packaging;
电子封装中无铅焊点的界面演化和可靠性研究
5.
Research on the Reliability of Solder Joints in Mixed Assembly and Structure Parameter Optimization of PBGA in Lead-free Transition
无铅过渡时期混合组装PBGA焊点可靠性及封装体结构参数优化研究
6.
Study on Damage Constitutive Model and Failure Mechanism of Lead-Free Solder in Microelectronic Packaging;
微电子封装中无铅焊料的损伤模型和失效机理研究
7.
The Study on the Effects of Lead-free Solder on the Dynamic Reliability of the Packaged Chip;
无铅焊料对电子封装芯片动态可靠性影响的研究
8.
Experimental Research and Reliability Analysis on Lead-free Solder Joints in Microelectronic Packaging
微电子封装中无铅焊点的实验研究与可靠性分析
9.
The Study of Low Temperature and Free-Pb Sealing Glass for Panel Dispay
平板显示器用低温无铅封接玻璃的研究
10.
Investigation of Electromigration on Lead-Free Solder Bump in Flip Chip Packaging
倒装芯片技术中无铅凸点电迁移研究
11.
Selection of Solder Paste in Electronic Assembly
电子组装中无铅焊膏的选择(续完)
12.
Research development of high temperature lead-free solders for electronic assembly
电子组装用高温无铅钎料的研究进展
13.
We found two vans with their seals missing and one van badly bruised. Please sign it.
我们发现两只集装箱铅封失落，一只集装箱严重擦损，请签字。
14.
Research and Development of Charger for Storage Battery with Power Factor Correction;
带功率因数校正的密封铅酸蓄电池充电装置的研制
15.
Cannot Encapsulate data when the page is being browsed.
当浏览数据页时，无法封装数据。
16.
The Influence on PCBAs Interconnect Reliability with Lead–Free Processing
无铅化组装对印制板组件互连可靠性的影响
17.
Analysis and Comparison of Thermal Stress and Hygrothermal Stress of Lead-free Flip Chip Solder Joint
无铅倒装焊点的热应力与湿热应力分析
18.
Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages.
集成电路倒装芯片封装中半导体芯片及载体之间形成可靠联接所用焊料中的铅。