1.
Optimization of Electroless Plating Ni-P Alloy Technology on the Surface of Brass Substrate;
黄铜基体化学镀Ni-P合金工艺优化研究
2.
Study on Microstructure and Process of Calorization Based on Pure Copper by Thermal Spraying;
纯铜基体热喷涂渗铝微观组织及工艺的研究
3.
a fine style of handwriting based on the writing used on copperplate engravings.
基于铜雕板的一种精美的手写体形式。
4.
THE CRYSTAL STRUCTURE OF BIS (o-HYDROXYBENZYLAMINE) COPPER(Ⅱ)HYDRATE
水合双邻羟基苄胺铜(Ⅱ)的晶体结构
5.
Arsenic in a copper concentrate can be rapidly determined by atomic fluorescenc, accompanied with less interference from base copper.
用原子荧光光谱法可快速测定铜矿样中的砷，且基体铜干扰小。
6.
Ligand-free Copper Catalyzed N-Arylation Reaction of o-Aminophenol
无配体铜催化邻氨基酚的N-芳基化反应研究
7.
The microstructure of electroless copper deposit is greatly effected by the substrate upon which deposition occurs.
化学镀铜层的显微结构受基体的显著影响。
8.
THE MOLECULAR STRUCTURE AND CRYSTAL STRUCTURE OF BIS (o-HYDROXYBENZYLAMINE) COPPER(Ⅱ)
无水双邻羟基苄胺铜(Ⅱ)的分子结构与晶体结构
9.
Separation of copper with ammonium sulfate-ammonium thiocyanate-ethyl violet flotation system
硫酸铵-硫氰酸铵-乙基紫体系浮选分离铜
10.
Studies on Solid Metal Complexes of o-Hydroxybenzyl-Amine (HBA) with Cu(Ⅱ), Fe(Ⅲ)
铜(Ⅱ)、铁(Ⅲ)与邻羟基苄胺固体配合物的研究
11.
Study on the Formula and Technology of Pollution-Free Electroless Copper Plating on Steel;
钢铁基体无公害化学镀铜配方及工艺研究
12.
Determination of Trace Copper by Solid Substrate-Room Temperature Phosphorescence Quenching Method B;
固体基质室温燐光猝灭法测定痕量的铜
13.
Synthesis and Crystal Structure of a Cu(Ⅱ) Complex of N-Salicylidene-2-Nitroaniline
水杨醛缩邻硝基苯胺合铜的合成与晶体结构
14.
Influence of CO_3~(2-) on Copper Electrocrystallization from 1-Hydroxyethylene-1,1-diphosphonic Acid Baths
CO_3~(2-)对羟基乙叉二膦酸体系铜电结晶的影响
15.
Synthesis and Crystal Structure of [CuL(4,4'-bipy)(2,2'-bipy)H_2O]_n Coordination Polymer
2-巯基乙磺酸铜配位聚合物的合成与晶体结构
16.
Separation of cuprum with sodium nitrate-potassium iodide tetradecyldimethyl-ammoniumchloride system;
硝酸钠—碘化钾—氯化十四烷基二甲基苄基铵体系浮选铜
17.
Research on the Application of the Molecular Interaction Volume Model in the Cu-based Liquid Alloy Systems;
分子相互作用体积模型在铜基液态合金体系中的应用研究
18.
Separation of Copper(Ⅱ) by Sodium Chlorine-Sodium Diethyldithiocarbamate-Diphenyl Guanidine System
氯化钠-二乙基二硫代氨基甲酸钠-二苯胍体系分离铜(Ⅱ)