1.
Determination of Tungsten in Ni-W-P Alloy Electroplating Solution
Ni-W-P合金电镀液中钨的测定
2.
The Measurement of Content of Cr～(6+) and Cr～(3+) in the Electrochromiuming Solution by Double-Waveleanth Photometric Method;
双波长分光光度法测定镀铬电镀液中Cr～（6+）和Cr～（3+）含量
3.
A Study on Stability of Nano-ZrO_2 in Ni-based Electroplating bath;
纳米ZrO_2在Ni基电镀液中悬浮稳定性的研究
4.
Direct Determination of Hexavalent Chromium in Trivalent Chromium Plating Bath
电镀三价铬镀液中Cr~(6+)的直接测定
5.
Summarizes continuous plating processes for electronic connector assemblies including gold, palladium and, tin plating solutions, properties of the films, and continuous plating equipment.
综述了接插件连续镀金、、的电镀工艺，包括设备、液和镀层性质。
6.
Pure nickel deposits were obtained from the traditional Watt nickel plating bath by pulse electroplating .
采用传统的瓦特镀液通过脉冲电镀制得纯镍镀层。
7.
Effects of NiSO_4 content in plating bath on the quality of Ni-W alloy coating
镀液中硫酸镍浓度对镍钨合金镀层电镀质量的影响
8.
Effect of Ni/Zn Ratio in Plating Solution on Zn-Ni Electroplating of Acidic Liquid
镀液中镍锌含量比对酸性液电镀Zn-Ni合金的影响
9.
Automatic Potential Titration Analysis on Bright Acid Electroplating Copper Bath
自动电位滴定分析光亮酸性镀铜溶液
10.
Study of hollow fiber renewal liquid membrane process used for treating nickel-containing electroplating wastewater
中空纤维更新液膜处理含镍电镀废水
11.
Treatment of cyanide-containing wastewater and waste residue from cyanide electroplating bath
氰化电镀槽液和含氰废水、废渣的处理
12.
Development of Electroless Nickel Plating Bath EN-600 for PCBs
电路板化学镀镍液EN-600的研制
13.
Study on Nickel Reclamation from the Spent Electroless Nickel Plating Bath by Electrolysis
电解法回收化学镀镍废液中镍的研究
14.
Development of Electroless Gold Plating Bath IG-600 for PCBs
电路板化学镀金液IG-600的研制
15.
Feasibility Study on Electrolysis Regeneration of Spent Electroless Nickel Plating Bath
电解再生化学镀镍老化液可行性研究
16.
The diamond wheel for grinding magnet shoe with low sagitta was manufactured by composite electroplating in Ni-Co alloy electrolyte.
采用镍-钴合金镀液电镀出磨低拱高磁瓦的金刚石砂轮。
17.
Study on Amorphous Iron-chromium Alloy Electrodepositing From Trivalent Chromium Bath;
从三价铬镀液中电沉积非晶态铁铬合金镀层的研究
18.
Investigations of Nucleation Mechanism in Initial Period for Direct Electroless Nickel-boron Plating on Magnesium Alloy and Electrochemical Properties of Plating Solution
镁合金直接化学镀Ni-B初期成核机理及镀液电化学性能研究